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MEGA IDEA Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)

MEGA IDEA Stencil (QS729) برائے iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)
Rs.864.00
Rs.1,235.00
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MEGA-IDEA Bumblebee Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air

Product Description

The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.

Specifications

SpecificationDetails
Brand NameMega-Idea / Qianli
ModelQS729 (Bumblebee Series)
TypeBGA Reballing Stencil (IC Repair Tool)
MaterialHigh-quality Stainless Steel
Thickness0.12mm (Ultra Thin)
ApplicationiPhone Motherboard IC / Chip Reballing Repair
CompatibilityiPhone 17 / 17 Pro / 17 Pro Max / Air
OriginMainland China
ReusableYes
PackageMetal Sheet / Protective Pack (Depends on Batch)

Features

  • High-precision BGA reballing stencil
  • Premium stainless steel construction
  • Heat-resistant and durable design
  • Accurate IC pad alignment for iPhone 17 series
  • Ultra-thin 0.12mm precision stencil
  • Reusable for multiple repair cycles
  • Ideal for professional motherboard repair technicians

What's in the Box

  • 1 × MEGA-IDEA Bumblebee QS729 Stencil Sheet

Important Note

This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.

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  • Availability: 100 In Stock
  • Model: MEGA-IDEA QS729

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