RL 044 BGA STENCILS 0.3/0.35/0.4/0.5/0.12MM

RL-044 BGA Stencils Set (0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm)

RL-044 BGA Stencils Set – Multi-Size Universal Chip Reballing Templates for Mobile Repair

The RELIFE RL-044 BGA Stencils Set is a professional-grade reballing template set designed for mobile phone, laptop, and electronic IC repair. The set includes multiple stencil thickness options (0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm) to meet the requirements of different BGA IC chips.

These precision stainless-steel stencils provide accurate solder ball alignment during the reballing process, ensuring clean, reliable, and efficient repairs. They are ideal for mobile motherboard repair, CPU and GPU IC rework, micro soldering, and professional electronics servicing.

Key Features

• Multi-size BGA reballing stencil set.
• Available thicknesses: 0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
• Provides precise solder ball alignment.
• Manufactured from high-quality precision stainless steel.
• Durable, reusable, and corrosion-resistant.
• Suitable for mobile phone, laptop, and electronic IC repair.
• Ideal for professional technicians and repair workshops.

Specifications

Features

• Universal multi-size stencil set
• Accurate solder ball positioning
• High-precision laser-cut openings
• Strong stainless-steel construction
• Reusable and long-lasting
• Compatible with various BGA IC chips
• Suitable for professional repair work

What's in the Box

• 1 × RL-044 BGA Stencils Set (Multiple Sizes)

Dimensions & Weight