MC XZ10 (0.2mm) SOLDER BALL

Description: MC XZ10 0.2 mm Solder Balls are ultra-fine solder spheres designed for precision BGA reballing and microscopic electronics repair. With a diameter of just 0.2 mm, they are ideal for very fine-pitch chips, ICs, and CSP packages. The balls are made from a high-purity solder alloy for excellent wetting, low oxidation, and reliable joint formation. Supplied in sealed bottles or gratings, they maintain consistency and quality for sensitive microelectronic work where precision is crucial. Features: * Precise 0.2 mm diameter spheres for ultra-fine-pitch BGA/CSP work * Excellent sphericity and tight diameter tolerance for uniform soldering * High-purity alloy formulation for clean melting and bonding * Optimized for minimal oxidation and contamination * Compatible with standard BGA reflow and micro-soldering profiles * Supplied in sealed, anti-oxidation packaging (bottles or trays) * Suitable for mobile repair, component-level rework, and high-density PCBs * Consistent joint quality even in tiny pads or microelectronic assemblies

• Availability: 50 In Stock
• Model: MC XZ10 (0.2mm) SOLDER BALL