MC XZ10 (0.4mm) SOLDER BALL

Description: The MC XZ10 (0.4 mm) solder ball is a precision BGA reballing component used for microelectronic repair. Each sphere is manufactured to strict tolerances to ensure uniformity, enabling reliable joints on fine-pitch IC pads. Made from high-purity solder alloy, these balls melt cleanly, provide excellent wetting, and resist oxidation. Supplied in a sealed bottle or tray, they are ideal for rework tasks on motherboards, smartphones, and other PCB assemblies where precise, repeatable solder connections are critical. Features: * **0.4 mm diameter** for fine-pitch BGA and micro-component use * High sphericity and size uniformity for consistent joints * Excellent thermal fatigue resistance and oxidation resistance * High-purity alloy (commonly Sn/Pb or lead-free variant) * Clean melting behavior and reliable wetting * Compatible with standard BGA reflow profiles * Suitable for BGA, CSP, QFN, and micro soldering tasks * Supplied in anti-oxidation sealed packaging (bottle or tray) * Conforms to environmental and safety standards (ROHS / REACH) * Available in multiple diameter variants (0.2 mm to 0.76 mm)

• Availability: 50 In Stock
• Model: MC XZ10 (0.4mm) SOLDER BALL