MC XZ10 (0.5mm) SOLDER BALL

Description: The MC XZ10 (0.5 mm) Solder Ball is a precision BGA (Ball Grid Array) reballing component used in microelectronics repair and production. Manufactured with high-purity tin-lead alloy (commonly Sn63Pb37), these solder balls are designed to provide excellent wetting, stable electrical connection, and consistent diameter. The 0.5 mm size is commonly used for mid-density BGA pads and packages. Supplied in a controlled dispensing format (e.g., bottle or tray), these balls are free from oxidation and optimised for reflow operations, making them ideal for IC chip attachment, BGA repair, and PCB rework. Features: * Precisely formed 0.5 mm diameter for BGA reballing * High-purity alloy (e.g., Sn63Pb37) for reliable solder joints * Excellent roundness and minimal surface oxidation * Consistent size tolerance to ensure uniform joints * Compatible with standard BGA reflow profiles * Easy dispensing from bottle or tray format * Suitable for fine-pitch BGA, QFN, and CSP devices * Improves yield and reliability in microelectronic repairs

• Availability: 50 In Stock
• Model: MC XZ10 (0.5mm) SOLDER BALL