Latest Products
-
Multifunctional Car Armrest Cushion, Armrest Storage Box, Car Armrest Cover, 7-in-1 Center Console Coverwith 2 Storage Bags Cup Holder, Tissue Box Slot, Phone Slot with Star Light 2 x USB C Type Charging Port
Rs.2,799.00 Rs.3,899.00 -
Smilife Blueberry Toner 100ml
Rs.2,100.00 Rs.3,000.00 -
SMILIFE BLUEBERRY LOTION
Rs.3,150.00 Rs.4,500.00 -
SMILIFE BLUEBERRY FACIAL CLEANSER 100g/Tube
Rs.1,260.00 Rs.1,800.00
MC S60 BGA/IC GLUE REMOVING LIQUID FOR IPHONE
Rs.1,500.00
Description:
The MC S60 BGA/IC Glue Removing Liquid is a professional-grade solvent formulated specifically for removing underfill and black adhesive (glue) from iPhone and other smartphone logic boards during IC reballing, replacement, or chip repair. It softens and dissolves tough epoxy and sealant materials around BGA chips without damaging pads, traces, or solder joints. The liquid offers excellent penetration and fast action, making the glue removal process cleaner, faster, and safer. Its mild, non-corrosive formula ensures compatibility with delicate circuit components, making it an essential solution for micro-soldering and chip-level repair technicians.
Features:
* Specially formulated for removing BGA and IC glue on iPhone logic boards
* Quickly softens and dissolves underfill and black adhesive materials
* Non-corrosive and safe for PCB pads, solder joints, and components
* Fast-acting with excellent glue penetration capability
* Ideal for chip removal, reballing, and reinstallation processes
* Reduces risk of pad lifting or damage during glue removal
* Easy to apply with brush or dropper for precise usage
* Suitable for professional phone repair and rework stations
- Availability: 50 In Stock
- Model: MC S60 BGA/IC GLUE REMOVING LIQUID FOR IPHONE