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MC TF350 FLUX PASTE FOR BGA
Rs.750.00
Description:
MC TF350 Flux Paste is a high-quality, no-clean flux specifically formulated for **BGA reballing, chip soldering, and SMD rework**. It ensures excellent solder wetting and strong bonding between component pads and solder balls while preventing oxidation during the reflow process. The paste offers stable performance at elevated temperatures, produces minimal smoke, and leaves non-corrosive residues that do not require post-cleaning. Its smooth, viscous texture allows easy application and even distribution on fine-pitch components, making it ideal for precision electronic repair and rework environments.
Features:
* Designed for BGA, SMD, and reballing operations
* Strong oxidation resistance and thermal stability
* Excellent solder flow and wetting performance
* Low-residue and non-corrosive formulation
* No-clean type; minimal post-solder cleanup required
* Smooth, viscous consistency for precise application
* Suitable for high-temperature soldering and rework
- Availability: 50 In Stock
- Model: MC TF350 FLUX PASTE FOR BGA