Automotive

Description: The MC D75T-B11 is a precision trinocular stereo microscope offering continuous zoom from 7× up to 50× magnification. It features a 45° inclined trinocular head (with 360° rotation) so you can view through eyepieces while attaching a camera. Designed for electronics, quality control, repair work, and inspection tasks, the D75T-B11 provides a stable B11 base, a large working distance, and modular adaptability for additional optics or lighting. Its all-metal construction and adjustable interpupillary distance make it suitable for extended lab or bench use. Key Features: * Continuous zoom range 7× to 50× * Trinocular viewing for simultaneous observation and imaging * 45° inclined, 360° rotatable head * Wide-field eyepieces (e.g. WF10× / 22 mm) * Adjustable interpupillary distance (e.g. 54-76 mm) * Auxiliary objective compatibility (e.g., 0.5×) * Long working distance (~~100 mm) * LED ring illumination with brightness control * Solid B11 base for stability * Dust-proof eyepiece tubes and coated optics

Description: MC Heat Tape 15 mm is a premium high-temperature polyimide (Kapton-style) tape designed for electronics, soldering, masking, and heat-intensive operations. It adheres securely and resists peeling at high temperatures while leaving minimal residue when removed. Its robust construction makes it ideal for protecting delicate components, insulating areas during reflow or hot-air work, and securing parts under thermal stress. Features: * 15 mm width for precision application * Long roll length (≈ 30 m) for extended use * High heat tolerance (up to ~ 260 °C or more for short periods) * Polyimide (Kapton) film construction with silicone adhesive * Leaves minimal or no residue after removal * Lightweight and compact for easy handling * Suitable for PCB masking, soldering stations, hot-air rework, and insulation

Description: The MC R300 Wick Wire 2515 is a solder wick (desoldering braid) made of fine copper strands, designed to absorb molten solder by capillary action. It’s used in electronics repair for cleaning solder joints, removing excess solder, or clearing pads on PCBs. The R300 variant is marketed as high-efficiency and able to withstand the heat without damage to surrounding components. Features: * Made from pure copper for excellent thermal conductivity * Fine braided structure to increase capillary action * High-efficiency solder absorption speed * Resistant to overheating and damage * Helps minimize heat transfer to components * Easy to position over pads or traces * Safe for repeated use until saturated * Suitable for use with various soldering irons and stations

Description: The MC R300 Wick Wire 1515 is a fine copper desoldering braid designed for precision solder removal in electronic repair and rework. Its narrow 1.5 mm width allows for accurate cleaning of small pads and fine-pitch components without overheating nearby parts. Coated with flux to enhance solder absorption and flow, it delivers fast and clean desoldering performance. The wire’s compact design and flexible structure make it ideal for use with standard soldering irons in PCB service, microelectronics, and circuit maintenance. Features: * Made from high-purity copper for fast heat transfer * Flux-coated braid for superior solder absorption * Fine 1.5 mm width for delicate solder joints * Pre-treated to resist oxidation and improve shelf life * Works efficiently with all standard soldering tips * Leaves no residue or damage on PCB surfaces * Lightweight and easy to handle for precision rework * Compact reel for convenient storage and portability

Description: The MC XZ10 (0.5 mm) Solder Ball is a precision BGA (Ball Grid Array) reballing component used in microelectronics repair and production. Manufactured with high-purity tin-lead alloy (commonly Sn63Pb37), these solder balls are designed to provide excellent wetting, stable electrical connection, and consistent diameter. The 0.5 mm size is commonly used for mid-density BGA pads and packages. Supplied in a controlled dispensing format (e.g., bottle or tray), these balls are free from oxidation and optimised for reflow operations, making them ideal for IC chip attachment, BGA repair, and PCB rework. Features: * Precisely formed 0.5 mm diameter for BGA reballing * High-purity alloy (e.g., Sn63Pb37) for reliable solder joints * Excellent roundness and minimal surface oxidation * Consistent size tolerance to ensure uniform joints * Compatible with standard BGA reflow profiles * Easy dispensing from bottle or tray format * Suitable for fine-pitch BGA, QFN, and CSP devices * Improves yield and reliability in microelectronic repairs

Description: The MC XZ10 (0.4 mm) solder ball is a precision BGA reballing component used for microelectronic repair. Each sphere is manufactured to strict tolerances to ensure uniformity, enabling reliable joints on fine-pitch IC pads. Made from high-purity solder alloy, these balls melt cleanly, provide excellent wetting, and resist oxidation. Supplied in a sealed bottle or tray, they are ideal for rework tasks on motherboards, smartphones, and other PCB assemblies where precise, repeatable solder connections are critical. Features: * **0.4 mm diameter** for fine-pitch BGA and micro-component use * High sphericity and size uniformity for consistent joints * Excellent thermal fatigue resistance and oxidation resistance * High-purity alloy (commonly Sn/Pb or lead-free variant) * Clean melting behavior and reliable wetting * Compatible with standard BGA reflow profiles * Suitable for BGA, CSP, QFN, and micro soldering tasks * Supplied in anti-oxidation sealed packaging (bottle or tray) * Conforms to environmental and safety standards (ROHS / REACH) * Available in multiple diameter variants (0.2 mm to 0.76 mm)

Description: The MC XZ10 (0.3 mm) solder ball is a high-precision reballing component used for microelectronic repair and BGA rework. Each solder sphere is manufactured with tight tolerances to ensure uniformity and consistency, enabling reliable connections in fine-pitch IC packages. The balls are made from a high-purity solder alloy, which promotes excellent wetting behaviour, low oxidation, and strong bond formation during reflow. Packaged in anti-oxidation sealed bottles, the XZ10 0.3 mm balls are ideal for use in smartphone, computer, and PCB rework environments where accuracy and cleanliness are critical. Features: * 0.3 mm diameter for fine-pitch BGA and micro-component applications * Strict size tolerance and high sphericity for consistent soldering performance * High-purity solder alloy (often Sn63Pb37 or equivalent) * Excellent wetting and minimal oxidation during reflow * Compatible with standard BGA reflow profiles * Supplied in sealed, anti-oxidation bottles or trays to preserve integrity * Suitable for BGA, QFN, CSP, and other high-density package types * Helps improve yield and reliability in microelectronics rework

Description: MC XZ10 0.2 mm Solder Balls are ultra-fine solder spheres designed for precision BGA reballing and microscopic electronics repair. With a diameter of just 0.2 mm, they are ideal for very fine-pitch chips, ICs, and CSP packages. The balls are made from a high-purity solder alloy for excellent wetting, low oxidation, and reliable joint formation. Supplied in sealed bottles or gratings, they maintain consistency and quality for sensitive microelectronic work where precision is crucial. Features: * Precise 0.2 mm diameter spheres for ultra-fine-pitch BGA/CSP work * Excellent sphericity and tight diameter tolerance for uniform soldering * High-purity alloy formulation for clean melting and bonding * Optimized for minimal oxidation and contamination * Compatible with standard BGA reflow and micro-soldering profiles * Supplied in sealed, anti-oxidation packaging (bottles or trays) * Suitable for mobile repair, component-level rework, and high-density PCBs * Consistent joint quality even in tiny pads or microelectronic assemblies

Description: The **MC TIP 900M-T-SK** is a precision soldering iron tip designed for use with 900M series soldering stations and irons. It features a black surface finish and a knife-style (or slanted) blade geometry to facilitate efficient heat transfer and clean soldering in tight spaces. Made from oxygen-free copper as a base with iron plating and an anti-oxidation coating, it delivers rapid heat conduction, prolonged life, and smooth soldering performance. Its design supports lead-free soldering and maintains consistent temperature stability during small to medium solder jobs. Features: * Knife/slanted blade geometry for controlled and accurate solder flow * Base material: oxygen-free copper for fast heat conduction * Iron plating/steel plating over copper for wear resistance * Anti-oxidation coating to resist corrosion * Compatible with 900M series soldering irons/stations * Good performance in lead-free soldering conditions * Long service life under proper use * Precision sizing to match different tip models (e.g., 900M-T series) * Easy to replace/install

Description: The MC TIP 900M-T-TIS is a high-precision soldering tip made for use with 900M series soldering stations. It features a TIS (likely “T-Iron Steel” or similar) coating over a copper base, offering faster heat transfer while resisting wear and oxidation. The tip geometry is tailored for fine soldering tasks—micro-components, SMT pads, and rework—and supports stable temperature control and long life under repeated usage. Features: * Copper core for rapid heat conduction * TIS / steel plating for corrosion and wear resistance * Precision tip geometry for accuracy on small pads * Compatible with standard 900M series soldering irons * Good performance in both leaded and lead-free soldering * Easy to install and replace * Fits standard 900M tip holder diameter * Good tip life when properly tinned and maintained

Description: The **MC TIP 900M-T-TI** is a replacement soldering iron tip designed for the 900M-series soldering irons (e.g., Hakko-style 900M / 936 / 907, etc.). It uses a copper core coated with iron / “TI” plating (often called iron or Teflon-resistant alloy plating) to provide better durability, resistance to corrosion and wear, and stable heat transfer during soldering. The tip is suitable for general soldering tasks, including lead-free soldering, fine pitch work, and routine board repair. Its silver finish helps reduce oxidation, and its shape (often “K” or “knife” style) is usable for straight lines, drag soldering, or filling. Features: * Copper core for fast and efficient heat conduction * Iron/Ti plating for improved wear resistance and longer tip life * Silver / anti-oxidation surface finish * Compatible with 900M series soldering guns/stations * Suitable for both leaded and lead-free solder * Standard tip geometry (often “K” / knife) for versatile applications * Easy to install and replace * Works with standard 900M, 907, 936, 937 iron models

Description: The MC TIP 900M-T-K is a knife-style (K) tip designed for 900M series soldering irons. Its cutting-blade geometry gives it versatility for line, face, or point contact soldering. The tip’s body is made from a copper core for fast heat conduction, plated with a steel/iron surface layer to resist wear, oxidation, and corrosion. It is ideal for drag soldering, correcting solder bridges, and working on narrow-pitch SMD components. The robust plating and knife shape ensure durability and reliable performance even under repeated soldering cycles. Features: * Knife / “K” shape allows soldering using **line, face, or point** contact modes * Fast thermal conductivity via copper base core * Steel/iron plating over copper for enhanced durability and corrosion resistance * Compatible with lead-free and leaded solders * Ideal for drag soldering, de-bridging, and fine pitch rework * Precision tip geometry for accurate solder application * Easily replaceable in 900M series soldering iron handles * Long service life when properly tinned and maintained

Description: The MC 900M-T-C9+ is a compact, high-precision soldering station tailored for microelectronics repair, PCB rework, and fine soldering tasks. It supports multiple tip standards (like 936, T12, C210, and C245), enabling flexibility across different soldering styles. The station is designed for rapid heat-up, stable temperature control, and compatibility with delicate components. Its modular design and compact footprint make it ideal for low-space workbenches and professional repair labs. Features: * Fast heating and temperature stabilization * Supports a variety of tip standards (936, T12, C210, C245) * Compatible with “mini heating platform” / honeycomb heating pad * Adjustability for optimal soldering – precise temperature control * Durable tip design to resist wear and oxidation * Compact and space-saving layout * Useful for IC reballing, FPC/flex cable repair, and micro soldering * Ease of removing/installing connectors, flex cables, and chips

Description: The **MC C210 MIX Soldering Tip Set** is a precision multitype tip kit designed for C210-series soldering handles. This set includes multiple tip geometries (such as chisel, conical, and bevel) to accommodate a wide range of soldering needs—from fine detail work to broader heat delivery. Crafted with high-quality copper cores and durable plating, the tips heat quickly and hold thermal stability, enabling efficient soldering of small components, SMDs, connectors, and general board repair tasks. Features: * Multiple tip types (e.g. chisel, bevel, conical) in one set for flexible use * Compatible with C210 series soldering handles/cartridges * Fast heat-up and stable temperature retention * Copper core for excellent thermal conduction * Durable plating/coating for wear and oxidation resistance * Suitable for fine-pitch work and general soldering alike * Easy to replace and interchange within the set * Lightweight kit ideal for workshop use

Description: The MC TIP 900M-T-C (or TS) soldering iron tip is a precision cartridge tip designed for 900M-series soldering handles, especially T210 / C210 style systems. It offers fast heat transfer via a copper core with a plated surface (iron/alloy) to resist wear and oxidation. The “TS” version is tailored for fine soldering tasks in tight or small workspaces and can also be used to clean up solder bridges. This tip is suited for microelectronic repair, SMD work, board rework, and other applications where controlled, reliable thermal performance is needed. Features: * Designed for 900M / C210 / T210 compatible handles (TS variant) * Copper heat-conductive core for rapid temperature response * Durable plating (iron/alloy) for corrosion resistance and tip longevity * Good thermal stability even under continuous operation * Fine geometry suitable for detailed soldering or tight spaces * Useful for solder bridge correction or small repairs * Easy to install, replace, and maintain

Description: The MC C210 SK Soldering Iron Tip is a high-precision replacement tip designed for micro-soldering and SMD component repair. It provides excellent thermal conductivity for quick heat transfer, ensuring stable temperature control and smooth solder flow. Made from durable, oxidation-resistant materials, it offers a long service life and consistent performance, making it ideal for fine electronic work, PCB rework, and precision solder joints. Features: * High-precision tip for detailed soldering applications * Fast heat conduction and uniform temperature distribution * Compatible with C210-series soldering handles and stations * Anti-oxidation coating for extended durability * Suitable for SMD, microchips, and fine-pitch components * Easy to install and replace

Description: The MC C210 TI Soldering Iron Tip is a premium-grade precision tip designed for delicate soldering tasks involving small and sensitive components. It ensures excellent heat transfer, allowing for quick and stable temperature recovery during continuous use. Built with a high-quality, oxidation-resistant alloy, this tip delivers long-lasting durability and superior performance for micro-soldering, circuit board repairs, and SMD component work. Features: * Fine-tip design for precision soldering and rework * Rapid heat conduction with minimal temperature loss * Compatible with C210-series soldering handles and stations * Oxidation-resistant coating for extended tip life * Ideal for SMD, IC, and PCB soldering tasks * Easy to replace and maintain

Description: The MC C91-UV Camera Filter Adhesive is a specialised bonding solution designed for fixing and sealing UV camera filters and lens modules. It provides high transparency, strong adhesion, and excellent resistance to yellowing, ensuring optical clarity is maintained over time. The adhesive cures quickly under UV light, forming a durable bond that resists moisture, dust, and temperature variations, making it ideal for precision optical assembly and electronic repair applications. Features: * High-transparency formula for optical components * Fast UV curing with strong, durable adhesion * Resistant to yellowing, heat, and moisture * Ideal for bonding glass, metal, and plastic parts in cameras * Maintains optical clarity and prevents lens distortion * Easy to apply and clean for professional repair use

Description: The MC C90-UV Camera Blue Light Adhesive is a high-transparency UV-curable glue designed for bonding camera lenses, screens, and optical components. It provides strong adhesion under UV or blue light curing, forming a clear, durable bond that resists yellowing, moisture, and temperature fluctuations. Its fast-curing and non-shrinking properties make it ideal for precision work in mobile phone camera repair, lens assembly, and other optical bonding applications. Features: * UV/blue light curable adhesive for optical applications * High transparency for clear and distortion-free bonding * Strong adhesion with excellent temperature and moisture resistance * Non-yellowing and non-shrinking formulation * Suitable for glass, metal, and plastic materials * Ideal for phone camera, screen, and lens repair

Description: The MC C89 Camera Anti-Shake Adhesive is a specialised UV-curable bonding agent formulated for stabilising and securing camera lens modules and anti-shake components. It provides strong adhesion with excellent vibration resistance, ensuring stable image performance and structural integrity. Its clear, non-yellowing composition maintains optical clarity, while the fast-curing UV formula makes it ideal for precise camera and mobile repair applications. Features: * High-strength UV-curable adhesive for anti-shake lens modules * Excellent vibration and impact resistance * Transparent, non-yellowing formula for optical clarity * Fast curing under UV or blue light * Withstands heat, humidity, and mechanical stress * Ideal for mobile camera module assembly and lens stabilization