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KC UNIVERSAL STENCIL (KC UNIVERSAL STENCIL)
Description:
The KC 1004 Cloth Wiper is a soft, lint-free cleaning cloth designed for delicate electronic and optical surfaces. It removes fingerprints, dust, smudges, and residue from screens, lenses, and circuit boards without scratching or leaving fibres. Lightweight and anti-static, it is ideal for routine maintenance in repair shops and for personal use on sensitive devices.
Features:
* Lint-free, non-dust soft microfiber-type fabric
* Anti-static and non-abrasive for scratch-free cleaning
* Effectively removes oil, flux residue, and moisture
* Thin and flexible for reaching corners and tight areas
* Durable and washable for repeated use
* Safe for phone screens, camera lenses, glass panels, and circuit boards
* Lightweight and easy to store in toolkits
* Provides streak-free, residue-free cleaning finish
KC UNIVERSAL STENCIL (KC UNIVERSAL STENCIL)
Description:
The MC UFO Universal Stencil is a high-precision reballing stencil used for BGA (Ball Grid Array) chip repair and soldering applications. Designed for universal compatibility, it can be used with a wide range of ICs, CPUs, GPUs, and NAND chips during motherboard and mobile phone repair. Its ultra-fine laser-cut holes ensure accurate solder ball placement and consistent heating, allowing clean, even reballing results. Made from durable stainless steel, the MC UFO stencil resists warping under high temperatures and is ideal for professional rework stations and repair technicians.
Features:
* Universal design compatible with various IC, CPU, GPU, and NAND chips
* High-precision laser-cut holes for accurate solder ball alignment
* Made from premium stainless steel for durability and heat resistance
* Uniform thickness for consistent soldering results
* Suitable for reballing, chip alignment, and BGA solder paste application
* Works with hot air stations and rework machines
* Easy to clean and reusable multiple times
* Designed for professional mobile and motherboard repair use
KC UNIVERSAL STENCIL BLACK (KC UNIVERSAL STENCIL BLACK)
Description"
The KC Universal Stencil Black is a precision-made reballing stencil designed for BGA chip repair and soldering work. Made from high-quality, heat-resistant metal, it allows technicians to accurately align and place solder balls on various integrated circuits during rework of smartphones, tablets, and other electronics. The black finish reduces glare under bright lights, helping to maintain focus during detailed soldering tasks. Its universal design is compatible with a wide range of IC sizes and patterns, making it a versatile tool for repair shops.
Features:
* Universal BGA stencil suitable for multiple IC chip sizes and patterns
* Black-coated surface to reduce glare under workbench lighting
* High-quality stainless steel construction for durability and heat resistance
* Precision laser-cut holes for accurate solder ball placement
* Flat and stable structure to ensure even heating during reballing
* Reusable and easy to clean after use
* Compatible with hot air and reflow soldering techniques
* Lightweight and portable, ideal for professional electronics repair kits
RL 044 BGA STENCILS 0.3/0.35/0.4/0.5/0.12MM (RELIFE RL-044)
RL-044 BGA Stencils Set (0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm)
RL-044 BGA Stencils Set – Multi-Size Universal Chip Reballing Templates for Mobile Repair
The RELIFE RL-044 BGA Stencils Set is a professional-grade reballing template set designed for mobile phone, laptop, and electronic IC repair. The set includes multiple stencil thickness options (0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm) to meet the requirements of different BGA IC chips.
These precision stainless-steel stencils provide accurate solder ball alignment during the reballing process, ensuring clean, reliable, and efficient repairs. They are ideal for mobile motherboard repair, CPU and GPU IC rework, micro soldering, and professional electronics servicing.
Key Features
- Multi-size BGA reballing stencil set.
- Available thicknesses: 0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
- Provides precise solder ball alignment.
- Manufactured from high-quality precision stainless steel.
- Durable, reusable, and corrosion-resistant.
- Suitable for mobile phone, laptop, and electronic IC repair.
- Ideal for professional technicians and repair workshops.
Specifications
| Brand | RELIFE |
| Model | RL-044 |
| Type | BGA Reballing Stencil Set |
| Thickness | 0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm |
| Material | Precision Stainless Steel |
| Application | Mobile Phone, Laptop, CPU, GPU, and IC Chip Reballing |
Features
- Universal multi-size stencil set
- Accurate solder ball positioning
- High-precision laser-cut openings
- Strong stainless-steel construction
- Reusable and long-lasting
- Compatible with various BGA IC chips
- Suitable for professional repair work
What's in the Box
- 1 × RL-044 BGA Stencils Set (Multiple Sizes)
Dimensions & Weight
| Weight | Approx. 20–40 g (Depending on Set) |
| Length | Approx. 13–15 cm |
| Width | Approx. 7–10 cm |
| Thickness | 0.12mm – 0.5mm (Model Dependent) |
Rl 044 bga اسٹینسلز 0.3/0.35/0.4/0.5/0.12 ملی میٹر
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