KC UNIVERSAL STENCIL

Description: The MC UFO Universal Stencil is a high-precision reballing stencil used for BGA (Ball Grid Array) chip repair and soldering applications. Designed for universal compatibility, it can be used with a wide range of ICs, CPUs, GPUs, and NAND chips during motherboard and mobile phone repair. Its ultra-fine laser-cut holes ensure accurate solder ball placement and consistent heating, allowing clean, even reballing results. Made from durable stainless steel, the MC UFO stencil resists warping under high temperatures and is ideal for professional rework stations and repair technicians. Features: * Universal design compatible with various IC, CPU, GPU, and NAND chips * High-precision laser-cut holes for accurate solder ball alignment * Made from premium stainless steel for durability and heat resistance * Uniform thickness for consistent soldering results * Suitable for reballing, chip alignment, and BGA solder paste application * Works with hot air stations and rework machines * Easy to clean and reusable multiple times * Designed for professional mobile and motherboard repair use

• Availability: 50 In Stock
• Model: KC UNIVERSAL STENCIL