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MEGA IDEA Stencil (QS729) برائے iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)
MEGA IDEA Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA) (MEGA-IDEA QS729)
MEGA-IDEA Bumblebee Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air
Product Description
The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea / Qianli |
| Model | QS729 (Bumblebee Series) |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | iPhone Motherboard IC / Chip Reballing Repair |
| Compatibility | iPhone 17 / 17 Pro / 17 Pro Max / Air |
| Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Pack (Depends on Batch) |
Features
- High-precision BGA reballing stencil
- Premium stainless steel construction
- Heat-resistant and durable design
- Accurate IC pad alignment for iPhone 17 series
- Ultra-thin 0.12mm precision stencil
- Reusable for multiple repair cycles
- Ideal for professional motherboard repair technicians
What's in the Box
- 1 × MEGA-IDEA Bumblebee QS729 Stencil Sheet
Important Note
This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.
MEGA IDEA Stencil (QS729) برائے iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)
MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil (MEGA-IDEA QS508)
MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil
Product Description
The MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and power IC repair. Manufactured from premium heat-resistant stainless steel, it delivers precise solder ball alignment for CPU reballing, rework, and motherboard-level repairs.
Its precision square-hole design with rounded corners ensures uniform solder ball formation, improving repair accuracy and success rates. This stencil is ideal for professional mobile phone repair technicians and advanced chip-level maintenance.
Specifications
| Specification | Details |
|---|---|
| Product Name | MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 |
| Brand | MEGA-IDEA / Qianli Bumblebee Series |
| Model | QS508 |
| Material | Premium Stainless Steel |
| Type | BGA CPU Reballing Stencil |
| Hole Design | Precision Square Holes with Rounded Corners |
| Application | CPU Reballing, Rework, Reflow Repair |
| Reusable | Yes |
| Heat Resistance | High Temperature Resistant |
| Compatibility | Qualcomm Snapdragon CPU Series |
| Usage | Mobile Phone Motherboard Repair |
Supported Qualcomm CPUs
- SM7225 (Snapdragon 750G)
- SM6350 (Snapdragon 690)
- SM6375 (Snapdragon 695)
- SM7125 (Snapdragon 720G)
- SM4250 (Snapdragon 460)
- SM6115 (Snapdragon 662)
- SM7250 (Snapdragon 765G)
- SM4375
Additional Supported ICs
- PM6250
- PM7250
- PM8350
- WCN3950
- WCN3988
- WCN3991
- WCN3998
- PMI632
- SMB1351
- SMB1395
- QDM3301 and other compatible ICs
Features
- Professional BGA CPU reballing stencil
- Premium heat-resistant stainless steel construction
- Precision square-hole design for accurate solder ball placement
- Rounded hole corners for improved solder ball formation
- Reusable and durable for repeated repair work
- Ideal for Qualcomm Snapdragon CPU and PMIC repair
- Designed for professional motherboard-level maintenance
What's in the Box
- 1 × MEGA-IDEA QS508 Qualcomm CPU Reballing Stencil
Approximate Package Information
| Item | Value |
|---|---|
| Weight (WT) | 10 g |
| Length (L) | 9 cm |
| Width (W) | 9 cm |
| Height (H) | 0.1 cm |
Note
Package dimensions and product appearance may vary slightly depending on the manufacturing batch or supplier.
MEGA-IDEA qs508 کوالکوم cpu انٹیگریٹڈ سیریز 8 اسٹینسل
QIANLI Qualcomm Series (17PCS) UV Stencil Set (Qualcomm Series 17PCS UV)
QIANLI Qualcomm Series (17PCS) UV Stencil Set
Product Description
The QIANLI Qualcomm Series (17PCS) UV Stencil Set is a professional solder mask repair stencil kit designed for Qualcomm CPU and motherboard pad restoration. It is used with UV green oil to repair damaged solder masks, rebuild missing pad insulation, and restore motherboard surfaces after chip removal or under-IC wire repairs. Each stencil is manufactured according to original factory pad layouts for precise alignment and accurate repair results.
Specifications
Specification | Details |
Brand | QIANLI |
Product Type | UV Solder Mask Repair Stencil Set |
Series | Qualcomm |
Quantity | 17 Pieces |
Material | High-Precision Stainless Steel |
Application | Solder Mask Repair & Pad Restoration |
Compatible Chips | Qualcomm CPU Series |
Alignment Accuracy | Factory Drawing Verified |
Reusable | Yes |
UV Curing Support | Yes |
Surface Finish | Burr-Free Precision Openings |
Features
- Designed specifically for Qualcomm CPU motherboard repair.
- High-precision stencil openings for accurate pad restoration.
- Manufactured from original factory layout data.
- Burr-free mesh holes help prevent uneven UV mask application.
- Suitable for repairing damaged solder mask and PCB insulation layers.
- Reusable professional repair tool for mobile phone technicians.
Supported Qualcomm Chipsets
- SM8450
- SM8350
- SM8150
- SM8250
- SM7250
- SM7350
- SM7225
- SM7125
- SM7450
- SM8550
- SM8475
- SDM845
- SM7150
- SM6450 / SM7435
and other Qualcomm series chipsets included in the stencil pack.
What's in the Box
- 17 × Qualcomm UV Repair Stencils
- 1 × Protective Storage Pack
Package Information
Item | Value |
Weight (WT) | Approx. 30 g |
Length (L) | Approx. 15 cm |
Width (W) | Approx. 10 cm |
Height (H) | Approx. 1 cm |
Qianli کوالکوم سیریز (17 عدد) uv اسٹینسل سیٹ
RL 044 BGA STENCILS 0.3/0.35/0.4/0.5/0.12MM (RELIFE RL-044)
RL-044 BGA Stencils Set (0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm)
RL-044 BGA Stencils Set – Multi-Size Universal Chip Reballing Templates for Mobile Repair
The RELIFE RL-044 BGA Stencils Set is a professional-grade reballing template set designed for mobile phone, laptop, and electronic IC repair. The set includes multiple stencil thickness options (0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm) to meet the requirements of different BGA IC chips.
These precision stainless-steel stencils provide accurate solder ball alignment during the reballing process, ensuring clean, reliable, and efficient repairs. They are ideal for mobile motherboard repair, CPU and GPU IC rework, micro soldering, and professional electronics servicing.
Key Features
- Multi-size BGA reballing stencil set.
- Available thicknesses: 0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm.
- Provides precise solder ball alignment.
- Manufactured from high-quality precision stainless steel.
- Durable, reusable, and corrosion-resistant.
- Suitable for mobile phone, laptop, and electronic IC repair.
- Ideal for professional technicians and repair workshops.
Specifications
| Brand | RELIFE |
| Model | RL-044 |
| Type | BGA Reballing Stencil Set |
| Thickness | 0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm |
| Material | Precision Stainless Steel |
| Application | Mobile Phone, Laptop, CPU, GPU, and IC Chip Reballing |
Features
- Universal multi-size stencil set
- Accurate solder ball positioning
- High-precision laser-cut openings
- Strong stainless-steel construction
- Reusable and long-lasting
- Compatible with various BGA IC chips
- Suitable for professional repair work
What's in the Box
- 1 × RL-044 BGA Stencils Set (Multiple Sizes)
Dimensions & Weight
| Weight | Approx. 20–40 g (Depending on Set) |
| Length | Approx. 13–15 cm |
| Width | Approx. 7–10 cm |
| Thickness | 0.12mm – 0.5mm (Model Dependent) |
Rl 044 bga اسٹینسلز 0.3/0.35/0.4/0.5/0.12 ملی میٹر
MC IP 7 PLUS 3400mAh BATTERY (MC IP 7 PLUS)
MC IP 7 PLUS 3400mAh BATTERY
Description
Replace your old battery that doesn't last as long anymore, charges slowly, or is completely dead with our OEM quality battery.
- OEM quality or better
- NEW
- EACH battery has been previously tested
- Please fully charge the battery before the first use
- Each battery comes with a STRONG ADHESIVE to stick onto the body of the phone, making sure the battery won't get damage or damage other internal components by sliding and moving around.
Quality Description
- Standard - Comparable to OEM Quality
- Extended Capacity - Comparable to OEM Quality and mAh capacity
- Premium Plus - OEM parts and OEM quality
**PLEASE NOTE ABOUT THE TOOLS** - The tools are universal and are meant to assist in replacing MOST repair parts. However, you MAY need specific tools for your specific part that will NOT come with the universal tool kit. PLEASE CHECK BEFOREHAND THE TOOLS YOU NEED AND MESSAGE US TO SEE IF OUR TOOLS ARE COMPATIBLE.
Tool kit does NOT come with a Tri Wing Screwdriver.
Compatibility
- Apple iPhone 7 Plus (Extended Capacity) A1661 | A1784 | A1785 - 3400 mAh
Mc ip 7 پلس 3400mah کی بیٹری
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