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The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea / Qianli |
| Model | QS729 (Bumblebee Series) |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | iPhone Motherboard IC / Chip Reballing Repair |
| Compatibility | iPhone 17 / 17 Pro / 17 Pro Max / Air |
| Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Pack (Depends on Batch) |
This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.
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The MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and power IC repair. Manufactured from premium heat-resistant stainless steel, it delivers precise solder ball alignment for CPU reballing, rework, and motherboard-level repairs.
Its precision square-hole design with rounded corners ensures uniform solder ball formation, improving repair accuracy and success rates. This stencil is ideal for professional mobile phone repair technicians and advanced chip-level maintenance.
| Specification | Details |
|---|---|
| Product Name | MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 |
| Brand | MEGA-IDEA / Qianli Bumblebee Series |
| Model | QS508 |
| Material | Premium Stainless Steel |
| Type | BGA CPU Reballing Stencil |
| Hole Design | Precision Square Holes with Rounded Corners |
| Application | CPU Reballing, Rework, Reflow Repair |
| Reusable | Yes |
| Heat Resistance | High Temperature Resistant |
| Compatibility | Qualcomm Snapdragon CPU Series |
| Usage | Mobile Phone Motherboard Repair |
| Item | Value |
|---|---|
| Weight (WT) | 10 g |
| Length (L) | 9 cm |
| Width (W) | 9 cm |
| Height (H) | 0.1 cm |
Package dimensions and product appearance may vary slightly depending on the manufacturing batch or supplier.



The QIANLI Qualcomm Series (17PCS) UV Stencil Set is a professional solder mask repair stencil kit designed for Qualcomm CPU and motherboard pad restoration. It is used with UV green oil to repair damaged solder masks, rebuild missing pad insulation, and restore motherboard surfaces after chip removal or under-IC wire repairs. Each stencil is manufactured according to original factory pad layouts for precise alignment and accurate repair results.
Specification | Details |
Brand | QIANLI |
Product Type | UV Solder Mask Repair Stencil Set |
Series | Qualcomm |
Quantity | 17 Pieces |
Material | High-Precision Stainless Steel |
Application | Solder Mask Repair & Pad Restoration |
Compatible Chips | Qualcomm CPU Series |
Alignment Accuracy | Factory Drawing Verified |
Reusable | Yes |
UV Curing Support | Yes |
Surface Finish | Burr-Free Precision Openings |
and other Qualcomm series chipsets included in the stencil pack.
Item | Value |
Weight (WT) | Approx. 30 g |
Length (L) | Approx. 15 cm |
Width (W) | Approx. 10 cm |
Height (H) | Approx. 1 cm |







