







The YH C210 Bits (I, K, SI) are high-precision micro soldering iron tips/cartridges designed for C210 series soldering stations. These tips are widely used for mobile phone repair, PCB rework, SMD soldering, and precision electronic assembly.
Each tip features a unique shape for specific soldering applications. The C210 series provides rapid heat transfer, stable temperature control, and excellent precision, making it ideal for delicate electronic repair work.
| Specification | Details |
|---|---|
| Product Name | YH C210 Soldering Iron Bits (I / K / SI) |
| Series | C210 Micro Cartridge Tips |
| Brand | YH (Yihua / Compatible OEM) |
| Type | Soldering Iron Tip / Heating Cartridge |
| Compatibility | C210 / T210 Soldering Stations |
| Material | Copper Core with Iron Plating |
| Temperature Range | Approx. 100°C – 450°C (Station Dependent) |
| Heating Type | Integrated Heater + Sensor Cartridge |
| Applications | SMD Soldering, PCB Repair, Mobile Repair, Precision Electronics |
| Item | Value |
|---|---|
| Weight | Approx. 5–10 g (Per Tip) |
| Length (L) | Approx. 10–12 cm |
| Width (W) | Approx. 0.5–0.8 cm |
| Height (H) | Approx. 0.5–0.8 cm |
The YH C210 I, K, and SI soldering bits are premium precision cartridges engineered for professional electronics repair. Their fast heating, accurate temperature response, and specialized tip profiles make them an excellent choice for mobile technicians, PCB engineers, and anyone performing fine SMD soldering work.








The QIANLI MEGA-IDEA Black BGA Reballing Stencil is a professional universal reballing tool designed for BGA IC repair, mobile phone motherboard maintenance, and electronic chip rework. Manufactured from high-quality stainless steel, it provides precise solder ball placement and consistent alignment during the BGA reballing process.
Featuring multiple ball sizes including 0.3mm, 0.35mm, 0.4mm, and 0.5mm, this stencil is compatible with a wide range of BGA chips and ICs. Its black-coated finish enhances durability and heat resistance, making it an ideal choice for professional technicians and repair workshops.
Specifications
Specification | Details |
Brand | QIANLI |
Series | MEGA-IDEA Black |
Product Type | BGA Reballing Stencil |
Material | High-Quality Stainless Steel |
Ball Size Compatibility | 0.3mm / 0.35mm / 0.4mm / 0.5mm |
Color | Black |
Application | BGA IC Reballing |
Compatibility | Universal BGA Chips |
Design | Multifunction Universal Mesh |
Feature | High-Precision Hole Layout |
Usage | Mobile Repair, Motherboard Repair, IC Rework |
● Universal BGA reballing stencil design
● Supports 0.3mm, 0.35mm, 0.4mm, and 0.5mm solder balls
● High-quality stainless steel construction
● Accurate and uniform solder ball placement
● Durable black-coated finish
● Heat-resistant and reusable design
● Suitable for BGA IC repair and rework
● Ideal for mobile phone and motherboard repair technicians
● 1 × QIANLI MEGA-IDEA Black BGA Reballing Stencil
Item | Value |
Weight | Approx. 0.03 kg |
Length | Approx. 9 cm |
Width | Approx. 9 cm |
Thickness | Approx. 0.12 mm |





