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The YIHUA 862BD+ Rework Station is a professional 2-in-1 repair system that combines a hot air rework station and a soldering iron station in a compact unit. It is designed for mobile phone repair, PCB assembly, SMD rework, electronics maintenance, and DIY projects.
Featuring a high-performance hot air system and a precision soldering iron, the 862BD+ delivers fast heating, accurate temperature control, and stable operation. Its intelligent PID temperature control system ensures reliable performance, making it ideal for technicians, engineers, and electronics enthusiasts.
| Specification | Details |
|---|---|
| Model | YIHUA 862BD+ |
| System Type | 2-in-1 Rework Station |
| Functions | Hot Air Rework + Soldering Iron |
| Input Voltage | AC 220V–240V, 50/60Hz |
| Hot Air Power | 700W |
| Soldering Iron Power | 75W |
| Hot Air Temperature Range | 100°C – 480°C |
| Soldering Temperature Range | 200°C – 480°C |
| Airflow Type | Brushless Fan |
| Airflow Capacity | Up to 120 L/min |
| Temperature Control | PID Digital Control |
| Display | Dual LED Digital Display |
| Heating Element | Ceramic Heater |
| Sleep Function | Yes |
| ESD Safe | Yes |
| Weight | Approx. 3.5–4.5 kg |
| Item | Value |
|---|---|
| Weight | Approx. 3.5–4.5 kg |
| Length | Approx. 25 cm |
| Width | Approx. 18 cm |
| Height | Approx. 14 cm |
Sources: Technical specifications and dimensions verified from manufacturer information and reputable product listings.
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The QIANLI MEGA-IDEA Black BGA Reballing Stencil is a professional universal reballing tool designed for BGA IC repair, mobile phone motherboard maintenance, and electronic chip rework. Manufactured from high-quality stainless steel, it provides precise solder ball placement and consistent alignment during the BGA reballing process.
Featuring multiple ball sizes including 0.3mm, 0.35mm, 0.4mm, and 0.5mm, this stencil is compatible with a wide range of BGA chips and ICs. Its black-coated finish enhances durability and heat resistance, making it an ideal choice for professional technicians and repair workshops.
Specifications
Specification | Details |
Brand | QIANLI |
Series | MEGA-IDEA Black |
Product Type | BGA Reballing Stencil |
Material | High-Quality Stainless Steel |
Ball Size Compatibility | 0.3mm / 0.35mm / 0.4mm / 0.5mm |
Color | Black |
Application | BGA IC Reballing |
Compatibility | Universal BGA Chips |
Design | Multifunction Universal Mesh |
Feature | High-Precision Hole Layout |
Usage | Mobile Repair, Motherboard Repair, IC Rework |
● Universal BGA reballing stencil design
● Supports 0.3mm, 0.35mm, 0.4mm, and 0.5mm solder balls
● High-quality stainless steel construction
● Accurate and uniform solder ball placement
● Durable black-coated finish
● Heat-resistant and reusable design
● Suitable for BGA IC repair and rework
● Ideal for mobile phone and motherboard repair technicians
● 1 × QIANLI MEGA-IDEA Black BGA Reballing Stencil
Item | Value |
Weight | Approx. 0.03 kg |
Length | Approx. 9 cm |
Width | Approx. 9 cm |
Thickness | Approx. 0.12 mm |





