QIANLI MEGA-IDEA Black BGA Reballing Stencil 0.3 0.35 0.4 0.5mm Multifunction Universal Planting Tin Steel Mesh
QIANLI MEGA-IDEA Black BGA Reballing Stencil – Multifunction Universal Planting Tin Steel Mesh
Product Description
The QIANLI MEGA-IDEA Black BGA Reballing Stencil is a professional universal reballing tool designed for BGA IC repair, mobile phone motherboard maintenance, and electronic chip rework. Manufactured from high-quality stainless steel, it provides precise solder ball placement and consistent alignment during the BGA reballing process.
Featuring multiple ball sizes including 0.3mm, 0.35mm, 0.4mm, and 0.5mm, this stencil is compatible with a wide range of BGA chips and ICs. Its black-coated finish enhances durability and heat resistance, making it an ideal choice for professional technicians and repair workshops.
Specifications
Specification | Details |
Brand | QIANLI |
Series | MEGA-IDEA Black |
Product Type | BGA Reballing Stencil |
Material | High-Quality Stainless Steel |
Ball Size Compatibility | 0.3mm / 0.35mm / 0.4mm / 0.5mm |
Color | Black |
Application | BGA IC Reballing |
Compatibility | Universal BGA Chips |
Design | Multifunction Universal Mesh |
Feature | High-Precision Hole Layout |
Usage | Mobile Repair, Motherboard Repair, IC Rework |
⚡ Features
● Universal BGA reballing stencil design
● Supports 0.3mm, 0.35mm, 0.4mm, and 0.5mm solder balls
● High-quality stainless steel construction
● Accurate and uniform solder ball placement
● Durable black-coated finish
● Heat-resistant and reusable design
● Suitable for BGA IC repair and rework
● Ideal for mobile phone and motherboard repair technicians
What's in the Box
● 1 × QIANLI MEGA-IDEA Black BGA Reballing Stencil
Dimensions & Weight
Item | Value |
Weight | Approx. 0.03 kg |
Length | Approx. 9 cm |
Width | Approx. 9 cm |
Thickness | Approx. 0.12 mm |
