MC XZ10 (0.3mm) SOLDER BALL

Description: The MC XZ10 (0.3 mm) solder ball is a high-precision reballing component used for microelectronic repair and BGA rework. Each solder sphere is manufactured with tight tolerances to ensure uniformity and consistency, enabling reliable connections in fine-pitch IC packages. The balls are made from a high-purity solder alloy, which promotes excellent wetting behaviour, low oxidation, and strong bond formation during reflow. Packaged in anti-oxidation sealed bottles, the XZ10 0.3 mm balls are ideal for use in smartphone, computer, and PCB rework environments where accuracy and cleanliness are critical. Features: * 0.3 mm diameter for fine-pitch BGA and micro-component applications * Strict size tolerance and high sphericity for consistent soldering performance * High-purity solder alloy (often Sn63Pb37 or equivalent) * Excellent wetting and minimal oxidation during reflow * Compatible with standard BGA reflow profiles * Supplied in sealed, anti-oxidation bottles or trays to preserve integrity * Suitable for BGA, QFN, CSP, and other high-density package types * Helps improve yield and reliability in microelectronics rework

• Availability: 50 In Stock
• Model: MC XZ10 (0.3mm) SOLDER BALL