MC X6 FLUX PASTE 20GRAM

Description: The MC X6 Flux Paste is a high-activity flux designed to improve solder flow and bonding during PCB assembly, rework, and micro-soldering tasks. Its smooth, non-corrosive formula ensures excellent wetting action on pads and component leads, reducing oxidation and enabling clean, reliable solder joints. The paste minimises bridging and residue while enhancing heat transfer, making it ideal for smartphone motherboard repairs, BGA reballing, and fine-pitch SMD work. Packaged in a compact 20 g jar, it is easy to store and apply, making it a practical choice for both professional technicians and hobbyists. Key Features: * High-activity flux for improved solder adhesion and flow * Reduces oxidation and enhances heat transfer during soldering * Smooth, easy-to-apply consistency for precision work * Non-corrosive, low-residue formula keeps PCBs clean after use * Minimizes solder bridging and improves joint quality * Ideal for smartphone motherboard, BGA reballing, and SMD repairs * Convenient 20 g jar for controlled application and storage * Suitable for professional workshops and DIY electronics projects

• Availability: 50 In Stock
• Model: MC X6 FLUX PASTE 20GRAM