MC XG30 SPECIAL SOLDER PASTE 16GRAM

Description: The MC XG30 Special Solder Paste is a reliable soldering compound designed for precision PCB assembly, SMD soldering, and BGA reballing work. Its fine particle formula provides excellent viscosity and smooth consistency for accurate application on small pads and components. The paste ensures strong wetting action, consistent melting, and produces clean, durable solder joints with minimal residue after reflow. Ideal for smartphone motherboard repairs and microelectronic tasks, it offers professional-grade performance in a compact 16-gram syringe-style package for convenient and controlled dispensing. Key Features: * High-quality solder paste for BGA, SMD, and PCB repair work * Smooth, stable viscosity for precise placement and easy application * Strong adhesion and wetting for reliable, long-lasting solder joints * Low-residue formulation keeps boards cleaner after reflow * Consistent melting point for dependable performance during rework * Optimized for smartphone motherboard and micro-soldering applications * Compact 16 g syringe-type tube for accurate dispensing and reduced waste * Suitable for both professional workshops and DIY electronic projects

• Availability: 50 In Stock
• Model: MC XG30 SPECIAL SOLDER PASTE 16GRAM