MC XG50 SPECIAL SOLDER PASTE 35GRAM

Description: The MC XG50 Special Solder Paste is a high-quality leaded soldering compound formulated for precision PCB assembly, reballing, and micro-soldering of electronic components. With excellent viscosity and smooth consistency, it ensures easy application and strong adhesion to pads, enabling clean and reliable solder joints. The paste provides excellent wetting performance, uniform melting, and minimal residue after reflow, making it ideal for delicate smartphone motherboard repairs and BGA chip rework. Packed in a 35-gram syringe-type container, it is convenient to dispense and reduces waste during use. Key Features: * High-quality solder paste designed for PCB, BGA, and SMD work * Excellent viscosity and smooth flow for precise application * Strong wetting and adhesion for durable solder joints * Low-residue formula for cleaner finishes after reflow * Consistent melting point for reliable performance during reballing * Ideal for smartphone motherboard and micro-component repairs * Convenient 35 g syringe-style packaging for controlled dispensing * Suitable for both professional workshops and DIY electronics repair

• Availability: 50 In Stock
• Model: MC XG50 SPECIAL SOLDER PASTE 35GRAM