MC iT3 PRO TEMPERATURE CONTROL PREHEATING PLATFORM

Description: The MC iT3 PRO is a compact, intelligent temperature-control preheating platform designed for precision PCB and smartphone motherboard repair. It delivers uniform and stable heat directly through its built-in heating plate, allowing technicians to carry out delicate processes such as glue removal, delamination of layered boards, IC bonding, BGA tin reflow, and desoldering without the need for an external hot-air gun or soldering iron. Its fast-heating ceramic element, digital temperature and time control, and modular plate design make it efficient for repetitive repair jobs, especially on iPhone X to 15 Pro Max series and similar devices. The durable metal chassis and small footprint ensure stability on the workbench while saving space in repair labs. Key Features: Intelligent digital temperature control up to ≈ 260 °C Adjustable heating time from 10 s to 990 s Rapid ceramic-core heating for quick temperature rise Even heat distribution across the platform for safe PCB work Modular design supports swappable/expandable heating plates Eliminates need for auxiliary hot-air gun or soldering iron Compact metal body with anti-slip stable base Suitable for glue removal, tin planting, IC rework, delayering, and bonding Wide input voltage: 100 – 240 V AC, power ≈ 600 W

• Availability: 50 In Stock
• Model: MC iT3 PRO TEMPERATURE CONTROL PREHEATING PLATFORM