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Description: The MC MOS-4K is a high-resolution HDMI microscope camera engineered for precision inspection, electronics repair, and laboratory imaging. It features a Sony CMOS sensor that captures crystal-clear 4K visuals and outputs them directly through HDMI or USB, allowing you to view in real time on monitors or computers. Its robust metal housing ensures durability and helps with heat dissipation in extended operations. The camera supports advanced imaging controls such as exposure, white balance, and gain settings and is compatible with standard C/CS-mount microscope lenses. Ideal for PCB repair, component inspection, and microphotography, it brings high-end imaging capabilities to everyday workbench tasks. Features: * True 4K video output (3840 × 2160) @ 30 fps via HDMI * USB output also supports 4K capture * Sensor: Sony IMX415 1/2.8″, ~51 MP performance * Full HD mode: 1080p @ 60 fps * Supports memory/TF card storage (up to 64 GB) * Adjustable settings: exposure, white balance, gain * On-screen overlays: crosshair, grid, measurement lines * C/CS lens mount compatibility * Metal body for durability and thermal management * Plug-and-play setup with minimal configuration * Compatible with stereo and trinocular microscope systems

Description: The MC Super X PRO-B11 is a high-performance trinocular stereo microscope designed for professional laboratories, electronics repair, and precision inspection work. It features a continuous zoom optical system that delivers a wide magnification range, allowing users to smoothly adjust magnification without disrupting focus. The trinocular head allows simultaneous viewing through the eyepieces and connection to a camera or imaging device. Its mechanical design includes a robust column stand, adjustable illumination, and focusing mechanisms that provide stable, ergonomic operation for demanding tasks. This microscope is particularly suited for PCB repair, micro-assembly, quality control, and biological sample observation. Features: * Continuous zoom magnification (e.g. 6.5× to 52×) * Trinocular head for simultaneous observation and imaging * Widefield, high-eyepoint eyepieces for comfortable viewing * Interpupillary distance adjustment (typically ~52–76 mm) * 45° inclined and 360° rotatable head for flexible ergonomics * Fixed magnification limit/interlock mechanism to prevent sudden zoom shift * Large column-type stand (often B11 style) with stable base * LED or ring illumination with adjustable brightness * Compatible with C-mount/CS-mount camera adapters * Multiple auxiliary lenses for varying working distances (e.g., 0.3×, 0.4×, 0.5×, etc.) * Fine focusing and coarse focusing knobs

Description: The ROBOT 7060T-TG is a high-zoom trinocular stereo microscope built for precision inspection, electronics repair, and microassembly work. It features a continuous zoom range (7× to 60×) and a trinocular head that allows either direct viewing or attaching a camera for imaging. Its optics are optimised for sharp contrast and clarity even at high magnifications. The instrument is designed to provide stable focusing, ergonomic usability, and compatibility with modular accessories for lighting, cameras, and mounting. Features: * Continuous zoom magnification from **7× to 60×** * Trinocular head (for eyepiece + camera output) * Wide-field eyepieces (e.g. WF10× or WF10×25) * Zoom ratio of about 1:8.6 * Adjustable interpupillary distance for comfort (e.g., 55-75 mm) * Dust-proof eyepiece barrels to reduce contamination * Supplied with a camera adapter (0.45×) to improve imaging field * Solid alloy base for stability * Suitable for PCB, mobile repair, and small component inspection * Modular for adding auxiliary lenses, ring lights, and camera attachments

Description: The MC ROBOT 6560T-B11 is a high-zoom trinocular stereo microscope engineered for laboratory, inspection, and electronics rework tasks. It offers a wide magnification range (typically 6.5× to 60×), allowing detailed examination of micro-components while still giving enough working distance for tool access. Its trinocular head enables simultaneous viewing through eyepieces and attachment of a camera for imaging or recording. Built with precision optics and a sturdy B11 column stand, the microscope supports extended operation in demanding environments while maintaining image stability and ergonomic usage. Features: * Zoom magnification range of about **6.5× to 60×** * Trinocular head for simultaneous observation and imaging * Wide-field eyepieces for comfortable viewing * Adjustable interpupillary distance for user comfort * Dust-proof eyepiece tubes to protect internal optics * Coarse and fine focus control for precision adjustment * Stable B11 column stand for secure mounting * Modular design allowing addition of LED/ring lighting, cameras, and auxiliary lenses * Good working distance even at higher magnifications * Suitable for PCB repair, microassembly, inspection, and quality control tasks

Description: The MC MIC3-B11 is a versatile trinocular stereo microscope engineered for electronics repair, precision inspection, and micro-assembly tasks. It offers a continuous zoom optical system that allows seamless adjustment from low to medium magnification, enabling users to shift between overview and detailed inspection without losing focus. The trinocular head provides simultaneous viewing through eyepieces and attachment of a camera for imaging or recording. With its robust metal construction, ample working distance, and modular accessory compatibility, the MIC3-B11 is geared toward professional workbenches requiring both clarity and flexibility. Features: * Continuous zoom objective (approx. 0.7× to 5×) giving a zoom ratio around 1:7.1 * Magnification range roughly **7× to 50×**, expandable with auxiliary lenses (e.g., 0.5×) * 45° inclined trinocular head with 360° rotation * Adjustable interpupillary distance (≈ 54 mm to 76 mm) * Standard eyepieces (e.g. WF10×/25 mm wide field) * Optional eyepieces: WF10×/22 mm, WF15×/15 mm, WF20×/10 mm * Working distance around 100 mm * Large work platform (~~320 mm × 260 mm) * B11 column base for stable and height-adjustable support * Zoom handwheel designed for smooth, fatigue-reducing control * Dust-proof eyepiece tubes and protective covers * Compatible with auxiliary objectives (0.5×, 0.7×, 1.5×, 2×) * Suitable for integration with digital cameras or imaging modules

Description: The MC MOS760-B11 is a high-zoom trinocular stereo microscope designed for precision work and inspection in electronics, laboratory, and industrial settings. It offers a continuous 7× to 60× magnification range, giving both a broad overview and fine detail in one unit. The trinocular head allows simultaneous viewing through eyepieces and camera imaging. The 45° inclined head with 360° rotation and adjustable interpupillary distance ensures ergonomic flexibility. With a robust B11 column stand and modular design for auxiliary optics and lighting, the MOS760-B11 is built for prolonged use in demanding inspection and microassembly applications. Features: * Continuous zoom from 7× to 60× magnification * Trinocular head for simultaneous eyepiece and camera use * 45° inclined and 360° rotatable head for flexible viewing angles * Interpupillary distance adjustment (typical range approx. 54–76 mm) * Wide-field eyepieces (e.g. WF10×/25 mm standard) * Integrated LED illumination with adjustable brightness * Dust-proof optical paths * Modular support for auxiliary lenses (0.3×, 0.5×, etc.) * B11-type column base for stable mounting * Coarse focusing mechanism with smooth control * Suitable for PCB inspection, chip work, microfabrication, and quality inspection

Description: The MOS300-B11 is a trinocular stereo microscope designed for precision work such as electronics repair, inspection, and micro-assembly. It features a 45° inclined trinocular head (rotatable 360°) and allows both direct viewing through eyepieces and camera attachment for imaging. With a zoom optical system typically offering 6× to 45× magnification (expandable with auxiliary lenses), it offers both detailed inspection and a wide view. It also provides a comfortable working distance (about 100 mm) to allow space for tools under the lens. Additionally, the microscope supports modular accessories like LED ring lights, auxiliary objectives, and adaptable eyepieces to suit different tasks. Key Features: * Zoom magnification range: ~ 6× to 45× * Trinocular viewing for simultaneous eyepiece and camera use * 45° inclined, 360° rotatable head for ergonomics and flexibility * Adjustable interpupillary distance (e.g., ~54–76 mm) * Standard eyepieces: WF10× / 22 mm (wide field) * Compatibility with auxiliary lenses (0.3×, 0.5×, 0.75×, etc.) to expand magnification range * Working distance: ~ 100 mm * Sturdy B11 column base for stable support * Smooth focusing mechanism for precise control * Dust-proof eyepiece tubes and protective covers * Adaptable with LED/ring illumination systems

Description: The MC D75T-B11 is a precision trinocular stereo microscope offering continuous zoom from 7× up to 50× magnification. It features a 45° inclined trinocular head (with 360° rotation) so you can view through eyepieces while attaching a camera. Designed for electronics, quality control, repair work, and inspection tasks, the D75T-B11 provides a stable B11 base, a large working distance, and modular adaptability for additional optics or lighting. Its all-metal construction and adjustable interpupillary distance make it suitable for extended lab or bench use. Key Features: * Continuous zoom range 7× to 50× * Trinocular viewing for simultaneous observation and imaging * 45° inclined, 360° rotatable head * Wide-field eyepieces (e.g. WF10× / 22 mm) * Adjustable interpupillary distance (e.g. 54-76 mm) * Auxiliary objective compatibility (e.g., 0.5×) * Long working distance (~~100 mm) * LED ring illumination with brightness control * Solid B11 base for stability * Dust-proof eyepiece tubes and coated optics

Description: The MC R300 Wick Wire 2515 is a solder wick (desoldering braid) made of fine copper strands, designed to absorb molten solder by capillary action. It’s used in electronics repair for cleaning solder joints, removing excess solder, or clearing pads on PCBs. The R300 variant is marketed as high-efficiency and able to withstand the heat without damage to surrounding components. Features: * Made from pure copper for excellent thermal conductivity * Fine braided structure to increase capillary action * High-efficiency solder absorption speed * Resistant to overheating and damage * Helps minimize heat transfer to components * Easy to position over pads or traces * Safe for repeated use until saturated * Suitable for use with various soldering irons and stations

Description: The MC R300 Wick Wire 1515 is a fine copper desoldering braid designed for precision solder removal in electronic repair and rework. Its narrow 1.5 mm width allows for accurate cleaning of small pads and fine-pitch components without overheating nearby parts. Coated with flux to enhance solder absorption and flow, it delivers fast and clean desoldering performance. The wire’s compact design and flexible structure make it ideal for use with standard soldering irons in PCB service, microelectronics, and circuit maintenance. Features: * Made from high-purity copper for fast heat transfer * Flux-coated braid for superior solder absorption * Fine 1.5 mm width for delicate solder joints * Pre-treated to resist oxidation and improve shelf life * Works efficiently with all standard soldering tips * Leaves no residue or damage on PCB surfaces * Lightweight and easy to handle for precision rework * Compact reel for convenient storage and portability

Description: The MC XZ10 (0.5 mm) Solder Ball is a precision BGA (Ball Grid Array) reballing component used in microelectronics repair and production. Manufactured with high-purity tin-lead alloy (commonly Sn63Pb37), these solder balls are designed to provide excellent wetting, stable electrical connection, and consistent diameter. The 0.5 mm size is commonly used for mid-density BGA pads and packages. Supplied in a controlled dispensing format (e.g., bottle or tray), these balls are free from oxidation and optimised for reflow operations, making them ideal for IC chip attachment, BGA repair, and PCB rework. Features: * Precisely formed 0.5 mm diameter for BGA reballing * High-purity alloy (e.g., Sn63Pb37) for reliable solder joints * Excellent roundness and minimal surface oxidation * Consistent size tolerance to ensure uniform joints * Compatible with standard BGA reflow profiles * Easy dispensing from bottle or tray format * Suitable for fine-pitch BGA, QFN, and CSP devices * Improves yield and reliability in microelectronic repairs

Description: The MC XZ10 (0.4 mm) solder ball is a precision BGA reballing component used for microelectronic repair. Each sphere is manufactured to strict tolerances to ensure uniformity, enabling reliable joints on fine-pitch IC pads. Made from high-purity solder alloy, these balls melt cleanly, provide excellent wetting, and resist oxidation. Supplied in a sealed bottle or tray, they are ideal for rework tasks on motherboards, smartphones, and other PCB assemblies where precise, repeatable solder connections are critical. Features: * **0.4 mm diameter** for fine-pitch BGA and micro-component use * High sphericity and size uniformity for consistent joints * Excellent thermal fatigue resistance and oxidation resistance * High-purity alloy (commonly Sn/Pb or lead-free variant) * Clean melting behavior and reliable wetting * Compatible with standard BGA reflow profiles * Suitable for BGA, CSP, QFN, and micro soldering tasks * Supplied in anti-oxidation sealed packaging (bottle or tray) * Conforms to environmental and safety standards (ROHS / REACH) * Available in multiple diameter variants (0.2 mm to 0.76 mm)

Description: The MC XZ10 (0.3 mm) solder ball is a high-precision reballing component used for microelectronic repair and BGA rework. Each solder sphere is manufactured with tight tolerances to ensure uniformity and consistency, enabling reliable connections in fine-pitch IC packages. The balls are made from a high-purity solder alloy, which promotes excellent wetting behaviour, low oxidation, and strong bond formation during reflow. Packaged in anti-oxidation sealed bottles, the XZ10 0.3 mm balls are ideal for use in smartphone, computer, and PCB rework environments where accuracy and cleanliness are critical. Features: * 0.3 mm diameter for fine-pitch BGA and micro-component applications * Strict size tolerance and high sphericity for consistent soldering performance * High-purity solder alloy (often Sn63Pb37 or equivalent) * Excellent wetting and minimal oxidation during reflow * Compatible with standard BGA reflow profiles * Supplied in sealed, anti-oxidation bottles or trays to preserve integrity * Suitable for BGA, QFN, CSP, and other high-density package types * Helps improve yield and reliability in microelectronics rework

Description: MC XZ10 0.2 mm Solder Balls are ultra-fine solder spheres designed for precision BGA reballing and microscopic electronics repair. With a diameter of just 0.2 mm, they are ideal for very fine-pitch chips, ICs, and CSP packages. The balls are made from a high-purity solder alloy for excellent wetting, low oxidation, and reliable joint formation. Supplied in sealed bottles or gratings, they maintain consistency and quality for sensitive microelectronic work where precision is crucial. Features: * Precise 0.2 mm diameter spheres for ultra-fine-pitch BGA/CSP work * Excellent sphericity and tight diameter tolerance for uniform soldering * High-purity alloy formulation for clean melting and bonding * Optimized for minimal oxidation and contamination * Compatible with standard BGA reflow and micro-soldering profiles * Supplied in sealed, anti-oxidation packaging (bottles or trays) * Suitable for mobile repair, component-level rework, and high-density PCBs * Consistent joint quality even in tiny pads or microelectronic assemblies

Description: The MC 900M-T-C9+ is a compact, high-precision soldering station tailored for microelectronics repair, PCB rework, and fine soldering tasks. It supports multiple tip standards (like 936, T12, C210, and C245), enabling flexibility across different soldering styles. The station is designed for rapid heat-up, stable temperature control, and compatibility with delicate components. Its modular design and compact footprint make it ideal for low-space workbenches and professional repair labs. Features: * Fast heating and temperature stabilization * Supports a variety of tip standards (936, T12, C210, C245) * Compatible with “mini heating platform” / honeycomb heating pad * Adjustability for optimal soldering – precise temperature control * Durable tip design to resist wear and oxidation * Compact and space-saving layout * Useful for IC reballing, FPC/flex cable repair, and micro soldering * Ease of removing/installing connectors, flex cables, and chips

Description: The **MC C210 MIX Soldering Tip Set** is a precision multitype tip kit designed for C210-series soldering handles. This set includes multiple tip geometries (such as chisel, conical, and bevel) to accommodate a wide range of soldering needs—from fine detail work to broader heat delivery. Crafted with high-quality copper cores and durable plating, the tips heat quickly and hold thermal stability, enabling efficient soldering of small components, SMDs, connectors, and general board repair tasks. Features: * Multiple tip types (e.g. chisel, bevel, conical) in one set for flexible use * Compatible with C210 series soldering handles/cartridges * Fast heat-up and stable temperature retention * Copper core for excellent thermal conduction * Durable plating/coating for wear and oxidation resistance * Suitable for fine-pitch work and general soldering alike * Easy to replace and interchange within the set * Lightweight kit ideal for workshop use

Description: The MC TIP 900M-T-C (or TS) soldering iron tip is a precision cartridge tip designed for 900M-series soldering handles, especially T210 / C210 style systems. It offers fast heat transfer via a copper core with a plated surface (iron/alloy) to resist wear and oxidation. The “TS” version is tailored for fine soldering tasks in tight or small workspaces and can also be used to clean up solder bridges. This tip is suited for microelectronic repair, SMD work, board rework, and other applications where controlled, reliable thermal performance is needed. Features: * Designed for 900M / C210 / T210 compatible handles (TS variant) * Copper heat-conductive core for rapid temperature response * Durable plating (iron/alloy) for corrosion resistance and tip longevity * Good thermal stability even under continuous operation * Fine geometry suitable for detailed soldering or tight spaces * Useful for solder bridge correction or small repairs * Easy to install, replace, and maintain

Description: The MC C210 SK Soldering Iron Tip is a high-precision replacement tip designed for micro-soldering and SMD component repair. It provides excellent thermal conductivity for quick heat transfer, ensuring stable temperature control and smooth solder flow. Made from durable, oxidation-resistant materials, it offers a long service life and consistent performance, making it ideal for fine electronic work, PCB rework, and precision solder joints. Features: * High-precision tip for detailed soldering applications * Fast heat conduction and uniform temperature distribution * Compatible with C210-series soldering handles and stations * Anti-oxidation coating for extended durability * Suitable for SMD, microchips, and fine-pitch components * Easy to install and replace

Description: The MC C210 TI Soldering Iron Tip is a premium-grade precision tip designed for delicate soldering tasks involving small and sensitive components. It ensures excellent heat transfer, allowing for quick and stable temperature recovery during continuous use. Built with a high-quality, oxidation-resistant alloy, this tip delivers long-lasting durability and superior performance for micro-soldering, circuit board repairs, and SMD component work. Features: * Fine-tip design for precision soldering and rework * Rapid heat conduction with minimal temperature loss * Compatible with C210-series soldering handles and stations * Oxidation-resistant coating for extended tip life * Ideal for SMD, IC, and PCB soldering tasks * Easy to replace and maintain

Description: The MC C91-UV Camera Filter Adhesive is a specialised bonding solution designed for fixing and sealing UV camera filters and lens modules. It provides high transparency, strong adhesion, and excellent resistance to yellowing, ensuring optical clarity is maintained over time. The adhesive cures quickly under UV light, forming a durable bond that resists moisture, dust, and temperature variations, making it ideal for precision optical assembly and electronic repair applications. Features: * High-transparency formula for optical components * Fast UV curing with strong, durable adhesion * Resistant to yellowing, heat, and moisture * Ideal for bonding glass, metal, and plastic parts in cameras * Maintains optical clarity and prevents lens distortion * Easy to apply and clean for professional repair use