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Description: The Mechanic Thor Power is an advanced, IoT-enabled, programmable DC diagnostic power supply designed for electronics repair, especially in mobile phones, laptops, and smart devices. It acts as a regulated power source with diagnostic and data-logging capabilities. The unit supports expansion ports with multiple charging/boot protocols (e.g., PD, QC, etc.) and can wirelessly connect (Bluetooth/WiFi) to a PC or mobile app for remote monitoring, firmware updates, and fault curve analysis. It features a dual-screen OLED, multiple output ports, and is built to handle precise, real-time current/voltage adjustments while storing startup and fault current data. This tool is meant to replace multiple adapters in repair workflows and provide more insight into device power behaviour under test. Key Features: Maximum output: 35 V, 5 A (DC regulated) Input: AC 100–240 V, 50/60 Hz Multiple expansion and protocol ports: supports PD/QC fast charging protocols, boot protocols for iPhone and Android, and other protocol modules. Four USB-A expansion ports, two USB-C expansion ports and one DC regulated output port Three display screens / three-screen simultaneous display (multi-view) Built-in mechanical ammeter (5 A) plus dual digital OLED display for precise real-time readouts Cooling/thermal management system for stable operation under load Startup current fault data storage, current curve analysis, fault diagnostics Wireless connectivity (Bluetooth/WiFi) for logging, monitoring, cloud/app interface Compact design with good power handling for multi-device repair workflows

Description: The MC iT3 PRO is a compact, intelligent temperature-control preheating platform designed for precision PCB and smartphone motherboard repair. It delivers uniform and stable heat directly through its built-in heating plate, allowing technicians to carry out delicate processes such as glue removal, delamination of layered boards, IC bonding, BGA tin reflow, and desoldering without the need for an external hot-air gun or soldering iron. Its fast-heating ceramic element, digital temperature and time control, and modular plate design make it efficient for repetitive repair jobs, especially on iPhone X to 15 Pro Max series and similar devices. The durable metal chassis and small footprint ensure stability on the workbench while saving space in repair labs. Key Features: Intelligent digital temperature control up to ≈ 260 °C Adjustable heating time from 10 s to 990 s Rapid ceramic-core heating for quick temperature rise Even heat distribution across the platform for safe PCB work Modular design supports swappable/expandable heating plates Eliminates need for auxiliary hot-air gun or soldering iron Compact metal body with anti-slip stable base Suitable for glue removal, tin planting, IC rework, delayering, and bonding Wide input voltage: 100 – 240 V AC, power ≈ 600 W

Description: The MC IX5 Ultra is a high-performance universal preheating platform designed for professional PCB and smartphone motherboard repair. It offers rapid and uniform heating across a large working surface, making it ideal for tasks such as delayering, IC removal, BGA tin reflow, adhesive softening, and precise bonding. Equipped with advanced temperature-control technology, it ensures stable heat output that protects sensitive components from thermal shock. Its universal clamping design allows secure placement of a wide range of PCB sizes, while the heavy-duty metal chassis, anti-slip base, and user-friendly digital controls make it durable and efficient for continuous workshop use. Key Features: * Intelligent digital temperature control with wide adjustable range * High-power heating plate for fast and consistent thermal response * Large flat surface supports various PCB and smartphone motherboard sizes * Even heat distribution prevents localized overheating * Universal clamping system for stable board positioning * Ideal for glue removal, IC/BGA soldering, tin planting, and bonding work * Sturdy metal construction with anti-slip feet for safe operation * Energy-efficient heating element designed for long-term durability * Easy-to-read display with precise temperature and timer settings

Description: The MC IPX16 Mid-Layer Tinning Station Set is a specialised repair tool designed for professional reballing and mid-layer tinning of smartphone motherboards. It provides stable and precise heating to melt and evenly distribute solder across mid-layer pads during IC replacement, reballing, or bonding processes. The station’s uniform heat distribution helps prevent warping or thermal damage to delicate multilayer PCBs, while its quick heating response shortens repair time. Built with a durable metal body, ergonomic layout, and accurate temperature controls, the IPX16 set is ideal for technicians working on iPhone logic boards and other high-density circuit boards that require precise tinning of inner layers. Key Features: * Intelligent temperature-controlled heating for accurate tinning work * Stable, uniform heat distribution across the working platform * Quick heating ceramic element for reduced waiting time * Designed for mid-layer soldering, IC reballing, and pad tinning * Protects multilayer PCBs from thermal damage and warping * Heavy-duty metal construction for long-lasting durability * Compact, space-saving design for professional repair benches * User-friendly interface with precise temperature adjustment * Suitable for iPhone logic boards and similar high-density boards

Description: The MC HT20 Heating Platform is a high-efficiency preheating device designed for professional PCB and smartphone motherboard repair. It delivers rapid and consistent heat over a larger working area than standard compact models, making it ideal for adhesive removal, IC desoldering, tin reflow, and bonding applications. The platform’s advanced temperature control ensures stable and uniform heat distribution, protecting delicate components from thermal damage while improving work precision. Its robust metal chassis, slip-resistant base, and user-friendly design make it suitable for heavy-duty use in repair labs and workshops. Key Features: * Powerful ceramic heating plate for fast and efficient thermal response * Wide adjustable temperature range for different repair needs * Even heat distribution to prevent hot spots on PCBs * Larger heating surface for working with bigger boards and devices * Durable all-metal construction for long-lasting performance * Anti-slip base for stable and safe operation during repairs * Ideal for IC bonding, tin planting, adhesive softening, and desoldering * Energy-efficient heating element with precise temperature control * Compact, workshop-friendly design with simple operation

Description: The MC HT30 Heating Platform is a professional-grade preheating device engineered for efficient PCB, smartphone, and tablet motherboard repairs. It features a high-power heating plate that delivers fast, consistent, and evenly distributed heat across a larger surface area, making it ideal for adhesive softening, IC removal, tin reflow, and bonding operations. Its precise temperature control protects sensitive electronic components from overheating while ensuring smooth repair processes. Built with a durable metal body, non-slip base, and a wide heating area, the HT30 is designed for heavy-duty use in repair workshops requiring high performance and reliability. Key Features: * High-power ceramic heating plate for rapid heat-up time * Wide adjustable temperature range for different repair tasks * Large heating surface suitable for bigger PCBs and devices * Uniform heat distribution minimizes risk of thermal damage * Robust all-metal construction ensures durability and stability * Anti-slip base for secure positioning during operation * Ideal for adhesive removal, IC bonding, tin planting, and desoldering * Energy-efficient design with accurate temperature control * Easy-to-operate interface suitable for professional technicians

Description: The MC HT34 Heating Platform is a high-performance preheating station built for advanced PCB and smartphone motherboard repair. Designed with an enlarged heating plate, it provides rapid, stable, and evenly distributed heat to accommodate larger boards and complex repair tasks. Its precise temperature control prevents overheating of sensitive components while ensuring efficient adhesive removal, IC desoldering, tin reflow, and bonding processes. With its sturdy metal construction, slip-resistant base, and user-friendly controls, the HT34 is ideal for professional technicians who require durability, consistency, and reliability for continuous workshop use. Key Features: * High-power ceramic heating plate for quick thermal response * Wide adjustable temperature range for various repair needs * Extra-large heating surface for bigger PCBs and devices * Uniform heat distribution minimizes thermal damage risks * Durable all-metal body designed for long-term heavy-duty use * Stable anti-slip base for safer operation during repairs * Perfect for adhesive softening, IC removal, tin planting, and bonding * Energy-efficient design with precise and stable temperature output * Simple, user-friendly interface for workshop efficiency

Description: The MC V210 Portable Constant Temperature Soldering Pen is a lightweight, high-precision tool designed for quick and efficient soldering in electronics repair and assembly work. It features a constant-temperature control system that maintains a stable heat level for consistent solder joints, reducing the risk of overheating sensitive components. Its slim, ergonomic design makes it comfortable for extended use, while the fast-heating ceramic element ensures minimal waiting time. Compact and portable, the V210 is ideal for mobile technicians, hobbyists, and professional repair shops requiring reliable performance in a small, easy-to-handle soldering pen. Key Features: * Constant temperature control for stable soldering performance * Quick-heating ceramic element for faster start-up * Slim and ergonomic pen-style design for comfortable handling * Lightweight and portable for field and bench-top use * Energy-efficient design with reduced power consumption * Safe for delicate electronic components due to precise heat control * Durable tip for long-lasting operation and consistent heat transfer * Ideal for circuit board soldering, small electronics repairs, and DIY projects

Description: The MC WS One Spot Welding Short Killer is a specialized repair tool designed for safely removing solder bridges, fixing short circuits, and performing micro spot-welding tasks on smartphone motherboards and other delicate PCBs. It delivers controlled, high-temperature pulses to targeted areas, enabling precise removal of excess solder or repair of tiny conductive paths without damaging surrounding components. Compact and efficient, the WS One is particularly useful for technicians handling board-level faults such as power line shorts and micro-component soldering, offering accuracy, speed, and reliability in one versatile tool. Key Features: * Precision spot-welding function for repairing PCB shorts * Controlled high-temperature pulses for targeted solder removal * Rapid heating for quick and efficient micro-repairs * Minimizes risk of damaging nearby components * Compact and lightweight design for easy handling * Durable housing built for long-term professional use * Energy-efficient and safe for sensitive electronic boards * Ideal for smartphone, tablet, and small electronics board-level repairs

Description: The MC iSHORT PRO Multi-Function Short Killer is an advanced diagnostic and repair tool designed to locate, remove, and resolve short-circuit faults on smartphone motherboards and other delicate PCBs. It delivers controlled pulses to safely clear shorts on power lines and sensitive components without causing additional heat damage. With its multi-function capability, it supports short detection, repair, and micro-soldering assistance, making it highly effective for board-level troubleshooting. Its compact and robust design, precise energy output, and user-friendly controls make it an essential device for professional repair technicians who need accuracy and reliability in daily workshop operations. Key Features: * Multi-function design for short-circuit detection and repair * Safe and controlled pulse technology prevents overheating of components * Quick response for efficient fault-clearing on PCB circuits * Stable power output suitable for delicate motherboard repairs * Compact and portable design for convenient use on workbenches * Robust metal casing for durability and long-term service * Reduces risk of collateral damage during short-circuit removal * Ideal for smartphones, tablets, and other micro-electronic devices

Description: The MC XG50 Special Solder Paste is a high-quality leaded soldering compound formulated for precision PCB assembly, reballing, and micro-soldering of electronic components. With excellent viscosity and smooth consistency, it ensures easy application and strong adhesion to pads, enabling clean and reliable solder joints. The paste provides excellent wetting performance, uniform melting, and minimal residue after reflow, making it ideal for delicate smartphone motherboard repairs and BGA chip rework. Packed in a 35-gram syringe-type container, it is convenient to dispense and reduces waste during use. Key Features: * High-quality solder paste designed for PCB, BGA, and SMD work * Excellent viscosity and smooth flow for precise application * Strong wetting and adhesion for durable solder joints * Low-residue formula for cleaner finishes after reflow * Consistent melting point for reliable performance during reballing * Ideal for smartphone motherboard and micro-component repairs * Convenient 35 g syringe-style packaging for controlled dispensing * Suitable for both professional workshops and DIY electronics repair

Description: The MC XGS P50 Special Solder Paste is a premium-grade soldering compound developed for high-precision electronic assembly, BGA reballing, and fine-pitch SMD soldering. It features excellent viscosity and smooth consistency that allow precise placement and strong adhesion on PCB pads. This paste delivers consistent melting behaviour, strong wetting action, and minimal residue after reflow, ensuring clean and durable solder joints. Specially formulated for smartphone motherboard repairs and other microelectronic tasks, it offers reliable performance during intensive rework processes. The 42-gram syringe-style packaging makes it easy to dispense with accuracy and reduces material waste. Key Features: * High-performance solder paste for BGA, SMD, and PCB rework * Excellent viscosity and flow for precise, uniform application * Superior wetting and adhesion for strong solder joints * Low-residue formulation for cleaner reflow finishes * Consistent melting point for stable performance under heat * Optimized for smartphone motherboard repairs and micro-soldering * Convenient 42 g syringe-type tube for easy dispensing * Suitable for professional workshops and detailed electronics projects

Description: The MC XGS P30 Special Solder Paste is a high-quality soldering compound designed for precise PCB assembly, SMD soldering, and BGA reballing tasks. It features excellent viscosity and smooth consistency that enable easy application and strong adhesion to pads, producing clean and reliable solder joints. The paste provides consistent melting performance, superior wetting ability, and leaves minimal residue after reflow, making it ideal for delicate smartphone motherboard repairs and microelectronic components. Its compact 20-gram syringe-style packaging ensures controlled dispensing with minimal waste, making it convenient for both professional and DIY use. Key Features: * High-quality solder paste for BGA, SMD, and PCB rework applications * Smooth viscosity for precise and uniform application * Strong wetting and adhesion for reliable solder joints * Low-residue formula ensures cleaner reflow results * Consistent melting point suitable for delicate electronic work * Perfect for smartphone motherboard repairs and micro-soldering tasks * Convenient 20 g syringe-style tube for accurate dispensing * Ideal for both workshop professionals and hobbyist repairs

Description: The MC XG30 Special Solder Paste is a reliable soldering compound designed for precision PCB assembly, SMD soldering, and BGA reballing work. Its fine particle formula provides excellent viscosity and smooth consistency for accurate application on small pads and components. The paste ensures strong wetting action, consistent melting, and produces clean, durable solder joints with minimal residue after reflow. Ideal for smartphone motherboard repairs and microelectronic tasks, it offers professional-grade performance in a compact 16-gram syringe-style package for convenient and controlled dispensing. Key Features: * High-quality solder paste for BGA, SMD, and PCB repair work * Smooth, stable viscosity for precise placement and easy application * Strong adhesion and wetting for reliable, long-lasting solder joints * Low-residue formulation keeps boards cleaner after reflow * Consistent melting point for dependable performance during rework * Optimized for smartphone motherboard and micro-soldering applications * Compact 16 g syringe-type tube for accurate dispensing and reduced waste * Suitable for both professional workshops and DIY electronic projects

Description: The MC LW50 138°C Solder Paste is a low-temperature soldering compound specially formulated for delicate PCB work and sensitive electronic components. With a melting point of just 138°C, it reduces the risk of heat damage to fragile parts such as smartphone motherboards, LED strips, and other temperature-sensitive devices. The paste has a smooth, uniform consistency that allows precise application and strong wetting, ensuring reliable solder joints with minimal residue after reflow. Packaged in a 50 g jar, it is ideal for professional repair technicians who require efficient, low-heat soldering solutions. Key Features: * Low-temperature solder paste with a melting point of 138°C * Reduces risk of thermal damage to sensitive electronic components * Smooth, stable viscosity for accurate and clean application * Provides strong wetting and adhesion for durable solder joints * Leaves minimal residue after reflow for cleaner boards * Ideal for smartphone motherboard repairs and LED circuit soldering * Convenient 50 g jar for easy storage and repeated use * Suitable for both professional workshops and DIY repairs

Description: The MC X6 Flux Paste is a high-activity flux designed to improve solder flow and bonding during PCB assembly, rework, and micro-soldering tasks. Its smooth, non-corrosive formula ensures excellent wetting action on pads and component leads, reducing oxidation and enabling clean, reliable solder joints. The paste minimises bridging and residue while enhancing heat transfer, making it ideal for smartphone motherboard repairs, BGA reballing, and fine-pitch SMD work. Packaged in a compact 20 g jar, it is easy to store and apply, making it a practical choice for both professional technicians and hobbyists. Key Features: * High-activity flux for improved solder adhesion and flow * Reduces oxidation and enhances heat transfer during soldering * Smooth, easy-to-apply consistency for precision work * Non-corrosive, low-residue formula keeps PCBs clean after use * Minimizes solder bridging and improves joint quality * Ideal for smartphone motherboard, BGA reballing, and SMD repairs * Convenient 20 g jar for controlled application and storage * Suitable for professional workshops and DIY electronics projects

Description: The MC X9 Flux Paste is a premium-quality flux formulated to enhance solder flow and adhesion during PCB soldering, rework, and micro-component repairs. Its high-activity, low-residue formula effectively removes oxidation from soldering surfaces, ensuring strong and reliable joints while minimising bridging. The paste spreads smoothly for precise application and improves heat transfer to make soldering faster and cleaner. Ideal for smartphone motherboard repairs, BGA reballing, and SMD assembly, the MC X9 provides excellent performance in both professional repair shops and hobbyist projects. Key Features: * High-activity flux improves solder wetting and bonding * Effectively removes oxidation for cleaner solder joints * Low-residue, non-corrosive formula keeps PCBs clean after soldering * Smooth, even consistency for precise application on small pads * Enhances heat transfer to improve soldering efficiency * Minimizes solder bridging and improves joint quality * Ideal for smartphone motherboard repairs, BGA reballing, and SMD work * Convenient 20 g jar for easy storage and controlled dispensing

Description: The MC N6 Tip Refresher is a specially formulated compound designed to clean, restore, and re-tin oxidised soldering iron tips. It quickly removes built-up oxidation and residues that reduce heat transfer efficiency, reviving the tip’s solderability and extending its service life. By dipping a heated soldering tip into the refresher, it helps achieve smooth, shiny, and well-tinned surfaces for better solder flow during electronic repairs. Compact and easy to use, the MC N6 is an essential maintenance product for technicians to keep their soldering tools performing at their best. Key Features: * Effectively cleans and restores oxidized soldering tips * Re-tins the tip surface for improved heat transfer and solderability * Extends the lifespan of soldering iron tips * Quick and easy to use for routine tip maintenance * Improves solder flow and joint quality during repairs * Compact container suitable for workbench and field use * Reduces oxidation buildup that can damage tips over time * Ideal for both professional technicians and hobbyist users

Description: The MC UV10 Halogen-Free Flux Paste is a high-grade, environmentally friendly flux formulated to deliver superior soldering performance without the use of halogens. Designed for precision PCB assembly, BGA reballing, and SMD repairs, it enhances solder wetting and flow while effectively removing surface oxides to produce strong and reliable solder joints. Its halogen-free composition reduces the risk of corrosion, making it safer for sensitive electronic components and compliant with eco-standards. The paste offers smooth consistency, low residue after soldering, and excellent heat transfer, ensuring clean and efficient results for both professional technicians and hobbyists. Key Features: * Halogen-free, eco-friendly flux for safer soldering applications * Improves solder wetting and adhesion for strong joints * Effectively removes oxides for cleaner solder surfaces * Non-corrosive, low-residue formula protects PCBs after use * Provides smooth consistency for precise application on small pads * Enhances heat transfer for efficient reflow soldering * Ideal for smartphone motherboard, BGA reballing, and SMD assembly * Convenient jar packaging for easy storage and repeated use

Description: The MC UV11 Lead-Free Flux Paste is a premium-quality, eco-friendly flux specifically formulated for lead-free soldering applications. It enhances solder wetting and bonding, ensuring strong and reliable joints while protecting sensitive PCB surfaces during rework. The paste’s non-corrosive, low-residue composition prevents damage to components and leaves boards clean after soldering. With excellent heat transfer and smooth consistency, it is ideal for BGA reballing, SMD assembly, and smartphone motherboard repairs. The MC UV11 provides professional-grade performance while complying with environmental standards for safer and cleaner electronic repairs. Key Features: * Lead-free, eco-friendly flux designed for safer soldering processes * Improves solder wetting and adhesion for durable joints * Effectively removes oxides and enhances solder flow * Non-corrosive, low-residue formula keeps PCBs clean after use * Smooth consistency allows precise application on fine-pitch pads * Enhances heat transfer for efficient reflow soldering * Suitable for smartphone motherboard, BGA, and SMD rework * Convenient jar packaging for easy use and storage