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The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea / Qianli |
| Model | QS729 (Bumblebee Series) |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | iPhone Motherboard IC / Chip Reballing Repair |
| Compatibility | iPhone 17 / 17 Pro / 17 Pro Max / Air |
| Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Pack (Depends on Batch) |
This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.
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The MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and power IC repair. Manufactured from premium heat-resistant stainless steel, it delivers precise solder ball alignment for CPU reballing, rework, and motherboard-level repairs.
Its precision square-hole design with rounded corners ensures uniform solder ball formation, improving repair accuracy and success rates. This stencil is ideal for professional mobile phone repair technicians and advanced chip-level maintenance.
| Specification | Details |
|---|---|
| Product Name | MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 |
| Brand | MEGA-IDEA / Qianli Bumblebee Series |
| Model | QS508 |
| Material | Premium Stainless Steel |
| Type | BGA CPU Reballing Stencil |
| Hole Design | Precision Square Holes with Rounded Corners |
| Application | CPU Reballing, Rework, Reflow Repair |
| Reusable | Yes |
| Heat Resistance | High Temperature Resistant |
| Compatibility | Qualcomm Snapdragon CPU Series |
| Usage | Mobile Phone Motherboard Repair |
| Item | Value |
|---|---|
| Weight (WT) | 10 g |
| Length (L) | 9 cm |
| Width (W) | 9 cm |
| Height (H) | 0.1 cm |
Package dimensions and product appearance may vary slightly depending on the manufacturing batch or supplier.



The RELIFE RL-069 Rosin Short Circuit Detector is a professional handheld PCB diagnostic tool designed to help technicians quickly locate short-circuit faults on mobile phone, laptop, and other electronic motherboards. By converting rosin or flux into a fine atomized mist, the device allows repair technicians to visually identify hot or shorted components with greater accuracy.
Its compact pen-style design, USB rechargeable battery, and fast atomization technology make it an essential diagnostic tool for professional electronics repair workshops. The RL-069 reduces unnecessary heating of PCB areas and improves troubleshooting efficiency during motherboard repairs.
| Brand | RELIFE |
| Model | RL-069 |
| Type | Rosin Short Circuit Detector |
| Power Source | USB Rechargeable |
| Application | PCB Short Circuit Detection, Mobile Phone & Laptop Motherboard Repair |
| Design | Compact Pen-Style with Glass Atomization Chamber |




