Search

QIANLI Peanut Shape Opening Tool

Product Description

The QIANLI Peanut Shape Opening Tool is a professional mobile phone repair tool designed for safely opening smartphone screens, back glass, and frames without causing damage. Its unique peanut-shaped design provides a comfortable grip and improved control during disassembly.

The ultra-thin flexible blade easily slides into narrow gaps to separate adhesive, helping remove displays and back covers while minimizing the risk of scratches or cracks. It is an essential tool for professional technicians and repair workshops.

Specifications

Features

• Ultra-thin flexible blade for easy insertion
• Safe tool for LCD screen and back glass opening
• Made from durable memory steel or carbon fiber
• Laser-cut smooth edges help prevent scratches
• Ergonomic peanut-shaped design for improved grip and control
• Reusable and built for long-term professional use

What's in the Box

• 1 × QIANLI Peanut Shape Opening Tool

Important Note

This tool is designed for mobile phone screen removal, back glass separation, and frame opening during repair work. Use carefully with proper repair techniques to avoid damage to the device.

QIANLI Curved Shape Opening Tool

Product Description

The QIANLI Curved Shape Opening Tool is a professional mobile phone repair tool designed for the safe disassembly of smartphone screens, back glass, and frames. Its curved flexible blade provides easy access to tight adhesive areas where straight tools cannot reach, making the separation process smoother while reducing the risk of damage to the LCD or phone housing.

The ergonomic curved design offers improved leverage, precision, and control, making it an excellent choice for professional repair technicians and electronics workshops.

Specifications

Features

• Curved flexible precision design for easy insertion
• Safe tool for LCD screen and back glass opening
• Strong memory steel or flexible metal construction
• Laser-cut smooth edges help prevent scratches
• Ergonomic curved shape for improved grip and control
• Reusable and durable for long-term professional use

What's in the Box

• 1 × QIANLI Curved Shape Opening Tool

Approximate Dimensions

Important Note

Actual dimensions and material may vary slightly depending on the production version (Memory Steel or Flexible Metal variant).

MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil

Product Description

The MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and power IC repair. Manufactured from premium heat-resistant stainless steel, it delivers precise solder ball alignment for CPU reballing, rework, and motherboard-level repairs.

Its precision square-hole design with rounded corners ensures uniform solder ball formation, improving repair accuracy and success rates. This stencil is ideal for professional mobile phone repair technicians and advanced chip-level maintenance.

Specifications

Supported Qualcomm CPUs

• SM7225 (Snapdragon 750G)
• SM6350 (Snapdragon 690)
• SM6375 (Snapdragon 695)
• SM7125 (Snapdragon 720G)
• SM4250 (Snapdragon 460)
• SM6115 (Snapdragon 662)
• SM7250 (Snapdragon 765G)
• SM4375

Additional Supported ICs

• PM6250
• PM7250
• PM8350
• WCN3950
• WCN3988
• WCN3991
• WCN3998
• PMI632
• SMB1351
• SMB1395
• QDM3301 and other compatible ICs

Features

• Professional BGA CPU reballing stencil
• Premium heat-resistant stainless steel construction
• Precision square-hole design for accurate solder ball placement
• Rounded hole corners for improved solder ball formation
• Reusable and durable for repeated repair work
• Ideal for Qualcomm Snapdragon CPU and PMIC repair
• Designed for professional motherboard-level maintenance

What's in the Box

• 1 × MEGA-IDEA QS508 Qualcomm CPU Reballing Stencil

Approximate Package Information

Note

Package dimensions and product appearance may vary slightly depending on the manufacturing batch or supplier.

QIANLI 007 Glue Removal Blade – Precision Mobile Phone Repair Tool

Product Description

The QIANLI 007 Glue Remover Blade is a professional mobile repair tool designed for removing strong adhesive, black glue, and OCA glue from smartphone motherboards and LCD screens. It is specially engineered for chip-level repair tasks including CPU, NAND, IC, and BGA cleaning without damaging surrounding components.

Its ultra-thin, flexible blade allows precise scraping in confined spaces, making it an essential tool for professional mobile phone technicians and advanced motherboard repair.

Specifications

Key Features

• Removes strong black glue and OCA adhesive efficiently
• Ultra-thin blade for precise work in tight motherboard spaces
• Flexible blade minimizes the risk of damaging nearby components
• Anti-slip aluminum alloy handle for improved control and comfort
• Suitable for CPU, IC, NAND, BGA, and LCD frame cleaning
• Professional-grade tool for chip-level mobile phone repair
• Reusable replaceable blade system for long service life

Applications

• CPU glue removal
• IC and BGA cleaning
• NAND chip repair
• LCD frame adhesive removal
• OCA glue scraping
• Mobile phone motherboard repair

What's in the Box

• 1 × QIANLI 007 Handle
• 3 × Replaceable Glue Remover Blades

Package Information

Important Note

This precision scraping tool is intended for professional electronics repair. Handle the blade carefully to avoid injury or damage to delicate electronic components. Product dimensions and packaging may vary slightly depending on the manufacturing batch.