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Mega iDea MTK CPU1 Stencil (Mega iDea MTK CPU1)
MEGA-IDEA MTK CPU1 BGA Reballing Stencil
The MEGA-IDEA MTK CPU1 Stencil is a professional BGA reballing stencil designed for repairing MediaTek (MTK) CPU chips on mobile phone motherboards. Manufactured from high-grade 0.12mm stainless steel, it provides precise solder paste placement and accurate pad alignment for clean, reliable IC reballing. Its heat-resistant and reusable construction makes it an ideal tool for professional mobile repair technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea |
| Model | MTK CPU1 |
| Type | BGA Reballing Stencil (CPU IC Repair Tool) |
| Material | High-Grade Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | Mobile Phone Motherboard and IC Repair |
| Compatibility | Selected MediaTek (MTK) CPU Chipsets |
| Country of Origin | Mainland China |
| Reusable | Yes |
| Packaging | Metal Sheet / Protective Case (Varies by Batch) |
Features
- High-precision CPU reballing stencil.
- Manufactured from durable stainless steel.
- Heat-resistant and long-lasting construction.
- Accurate pad alignment for MediaTek CPU chips.
- Ultra-thin 0.12mm design for precise solder paste application.
- Reusable for multiple repair applications.
- Suitable for professional mobile phone repair and IC rework.
What's in the Box
- 1 × MEGA-IDEA MTK CPU1 Stencil Sheet
Important Note
This stencil is designed for specific MediaTek (MTK) CPU layouts. Always verify compatibility with your CPU model before reballing to ensure proper solder ball alignment and reliable repair results.
میگا آئیڈیا mtk cpu1 اسٹینسل
MEGA IDEA MTK CPU 4 Stencil (MEGA IDEA MTK CPU 4 )
MEGA-IDEA MTK CPU 4 BGA Reballing Stencil
The MEGA-IDEA MTK CPU 4 Stencil is a professional-grade BGA reballing stencil designed for repairing MediaTek (MTK) CPU chips on mobile phone motherboards. Manufactured from high-quality 0.12mm ultra-thin stainless steel, it provides precise solder paste placement and accurate pad alignment for clean and reliable IC rework. Its durable, heat-resistant, and reusable construction makes it an ideal tool for professional mobile repair technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea |
| Model | MTK CPU 4 |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-Quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | Mobile Phone Motherboard / CPU IC Repair |
| Compatibility | Specific MediaTek (MTK) CPU Chipsets |
| Country of Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Case (Varies by Batch) |
Features
- High-precision BGA reballing stencil.
- Durable stainless steel construction.
- Heat-resistant design.
- Accurate pad alignment for MediaTek CPU chips.
- Ultra-thin 0.12mm design for precise solder paste application.
- Reusable for multiple repair cycles.
What's in the Box
- 1 × MEGA-IDEA MTK CPU 4 Stencil Sheet
Important Note
This stencil is designed for specific MediaTek (MTK) CPU layouts. Always verify compatibility with your CPU model before use to ensure accurate solder ball alignment and reliable reballing results.
میگا آئیڈیا mtk cpu 4 اسٹینسل
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