Search Criteria

Search in product descriptions

Search in product model

Products meeting the search criteria

YIHUA 1000B- 4 in 1 Station - IR Infrared BGA, Preheater, Soldering Station and Hot Air Rework Station, plus a Temp Sensor, ºC/°F display, PCBs Holder, LED Lamp

View Write Review

YIHUA 1000B- 4 ان 1 اسٹیشن - IR انفراریڈ BGA، پری ہیٹر، سولڈرنگ اسٹیشن اور ہاٹ ایئر ری ورک اسٹیشن، علاوہ ایک ٹیمپ سینسر، ºC/ ° ایف ڈسپلے، پی سی بی ہولڈر، ایل ای ڈی لیمپ

Rs.86,450.00

Rs.123,500.00

QIANLI MEGA-IDEA Black BGA Reballing Stencil 0.3 0.35 0.4 0.5mm Multifunction Universal Planting Tin Steel Mesh

View Write Review

Qianli MEGA-IDEA سیاہ bga ریبلنگ اسٹینسل 0.3 ملی میٹر متعدد افعال یونیورسل پودے لگانے والے ٹن اسٹیل میش

Rs.824.00

Rs.1,178.00

YIHUA 1000B- 4 in 1 Station - IR Infrared BGA, Preheater, Soldering Station and Hot Air Rework Station, plus a Temp Sensor, ºC/°F display, PCBs Holder, LED Lamp (YIHUA 1000B)

YIHUA 1000B 4-in-1 IR Heating BGA Rework Station

The YIHUA 1000B 4-in-1 IR Heating BGA Rework Station is a professional-grade electronics repair workstation designed for advanced PCB and motherboard repair. It integrates an Infrared (IR) BGA Rework System, Bottom Preheater, Hot Air Rework Station, and Temperature-Controlled Soldering Iron into one powerful unit. Equipped with a digital temperature control system, adjustable airflow, PCB holder, LED lamp, temperature sensor, and °C/°F display, it delivers precise, safe, and efficient repairs for BGA, SMD, QFP, SOIC, and other delicate electronic components.

Ideal for mobile phone repair, laptop motherboard servicing, gaming console repair, industrial electronics maintenance, and professional rework laboratories.

Specifications

Specification	Details
Model	YIHUA 1000B
System Type	4-in-1 IR Heating BGA Rework Station
Functions	IR Heater + Bottom Preheater + Hot Air Station + Soldering Iron
Total Power Output	Approx. 1200W–1450W
Input Voltage	AC 220V ±10%, 50/60Hz
Hot Air Temperature	100°C – 480°C
Preheater Temperature	50°C – 200°C
IR Heater Temperature	50°C – 350°C
Soldering Iron Temperature	200°C – 480°C
Heating Technology	Infrared + Ceramic Heating
Temperature Control	PID Intelligent Digital Control
Display	LED Digital Display with °C / °F
Airflow Control	Adjustable
Additional Accessories	PCB Holder, LED Lamp, Temperature Sensor
Body Material	Industrial Metal Frame
Weight	Approx. 7–10 kg

Features

4-in-1 multifunction repair workstation
Infrared BGA heating technology for uniform heat distribution
Integrated bottom PCB preheater
Professional hot air rework station
Temperature-controlled soldering iron
PID intelligent digital temperature control
Digital LED display with °C/°F switching
Built-in temperature sensor for accurate monitoring
Adjustable airflow and heating output
PCB holder for secure motherboard positioning
LED working lamp for enhanced visibility
Suitable for BGA, SMD, QFP, SOIC and IC rework
Anti-static and heat-resistant construction
Stable performance for continuous professional use
Ideal for mobile phone, laptop, tablet and gaming console motherboard repair

What's in the Box

1 × YIHUA 1000B Main Unit
1 × Hot Air Gun
1 × Soldering Iron Handle
1 × Infrared Heating Lamp Assembly
1 × PCB Holder
1 × LED Working Lamp
1 × Temperature Sensor
1 × Hot Air Nozzle Set
1 × Power Cable
1 × User Manual

Dimensions & Weight

Item	Value
Weight	Approx. 7–10 kg
Main Unit Dimensions	Approx. 287 × 361 × 53 mm (Varies by Version)
Power Supply	AC 220V Industrial Use

View Write Review

Rs.86,450.00

Rs.123,500.00

QIANLI MEGA-IDEA Black BGA Reballing Stencil 0.3 0.35 0.4 0.5mm Multifunction Universal Planting Tin Steel Mesh (MEGA-IDEA Black )

QIANLI MEGA-IDEA Black BGA Reballing Stencil 0.3 0.35 0.4 0.5mm Multifunction Universal Planting Tin Steel Mesh

QIANLI MEGA-IDEA Black BGA Reballing Stencil – Multifunction Universal Planting Tin Steel Mesh

Product Description

The QIANLI MEGA-IDEA Black BGA Reballing Stencil is a professional universal reballing tool designed for BGA IC repair, mobile phone motherboard maintenance, and electronic chip rework. Manufactured from high-quality stainless steel, it provides precise solder ball placement and consistent alignment during the BGA reballing process.

Featuring multiple ball sizes including 0.3mm, 0.35mm, 0.4mm, and 0.5mm, this stencil is compatible with a wide range of BGA chips and ICs. Its black-coated finish enhances durability and heat resistance, making it an ideal choice for professional technicians and repair workshops.

Specifications

Specification	Details
Brand	QIANLI
Series	MEGA-IDEA Black
Product Type	BGA Reballing Stencil
Material	High-Quality Stainless Steel
Ball Size Compatibility	0.3mm / 0.35mm / 0.4mm / 0.5mm
Color	Black
Application	BGA IC Reballing
Compatibility	Universal BGA Chips
Design	Multifunction Universal Mesh
Feature	High-Precision Hole Layout
Usage	Mobile Repair, Motherboard Repair, IC Rework