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MEGA IDEA MTK CPU 4 Stencil (MEGA IDEA MTK CPU 4 )
MEGA-IDEA MTK CPU 4 BGA Reballing Stencil
The MEGA-IDEA MTK CPU 4 Stencil is a professional-grade BGA reballing stencil designed for repairing MediaTek (MTK) CPU chips on mobile phone motherboards. Manufactured from high-quality 0.12mm ultra-thin stainless steel, it provides precise solder paste placement and accurate pad alignment for clean and reliable IC rework. Its durable, heat-resistant, and reusable construction makes it an ideal tool for professional mobile repair technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea |
| Model | MTK CPU 4 |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-Quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | Mobile Phone Motherboard / CPU IC Repair |
| Compatibility | Specific MediaTek (MTK) CPU Chipsets |
| Country of Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Case (Varies by Batch) |
Features
- High-precision BGA reballing stencil.
- Durable stainless steel construction.
- Heat-resistant design.
- Accurate pad alignment for MediaTek CPU chips.
- Ultra-thin 0.12mm design for precise solder paste application.
- Reusable for multiple repair cycles.
What's in the Box
- 1 × MEGA-IDEA MTK CPU 4 Stencil Sheet
Important Note
This stencil is designed for specific MediaTek (MTK) CPU layouts. Always verify compatibility with your CPU model before use to ensure accurate solder ball alignment and reliable reballing results.
میگا آئیڈیا mtk cpu 4 اسٹینسل
MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil (MEGA-IDEA QS508)
MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil
Product Description
The MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 Stencil is a professional BGA reballing stencil specially designed for Qualcomm Snapdragon CPU and power IC repair. Manufactured from premium heat-resistant stainless steel, it delivers precise solder ball alignment for CPU reballing, rework, and motherboard-level repairs.
Its precision square-hole design with rounded corners ensures uniform solder ball formation, improving repair accuracy and success rates. This stencil is ideal for professional mobile phone repair technicians and advanced chip-level maintenance.
Specifications
| Specification | Details |
|---|---|
| Product Name | MEGA-IDEA QS508 Qualcomm CPU Integrated Series 8 |
| Brand | MEGA-IDEA / Qianli Bumblebee Series |
| Model | QS508 |
| Material | Premium Stainless Steel |
| Type | BGA CPU Reballing Stencil |
| Hole Design | Precision Square Holes with Rounded Corners |
| Application | CPU Reballing, Rework, Reflow Repair |
| Reusable | Yes |
| Heat Resistance | High Temperature Resistant |
| Compatibility | Qualcomm Snapdragon CPU Series |
| Usage | Mobile Phone Motherboard Repair |
Supported Qualcomm CPUs
- SM7225 (Snapdragon 750G)
- SM6350 (Snapdragon 690)
- SM6375 (Snapdragon 695)
- SM7125 (Snapdragon 720G)
- SM4250 (Snapdragon 460)
- SM6115 (Snapdragon 662)
- SM7250 (Snapdragon 765G)
- SM4375
Additional Supported ICs
- PM6250
- PM7250
- PM8350
- WCN3950
- WCN3988
- WCN3991
- WCN3998
- PMI632
- SMB1351
- SMB1395
- QDM3301 and other compatible ICs
Features
- Professional BGA CPU reballing stencil
- Premium heat-resistant stainless steel construction
- Precision square-hole design for accurate solder ball placement
- Rounded hole corners for improved solder ball formation
- Reusable and durable for repeated repair work
- Ideal for Qualcomm Snapdragon CPU and PMIC repair
- Designed for professional motherboard-level maintenance
What's in the Box
- 1 × MEGA-IDEA QS508 Qualcomm CPU Reballing Stencil
Approximate Package Information
| Item | Value |
|---|---|
| Weight (WT) | 10 g |
| Length (L) | 9 cm |
| Width (W) | 9 cm |
| Height (H) | 0.1 cm |
Note
Package dimensions and product appearance may vary slightly depending on the manufacturing batch or supplier.
MEGA-IDEA qs508 کوالکوم cpu انٹیگریٹڈ سیریز 8 اسٹینسل
QIANLI Qualcomm Series (17PCS) UV Stencil Set (Qualcomm Series 17PCS UV)
QIANLI Qualcomm Series (17PCS) UV Stencil Set
Product Description
The QIANLI Qualcomm Series (17PCS) UV Stencil Set is a professional solder mask repair stencil kit designed for Qualcomm CPU and motherboard pad restoration. It is used with UV green oil to repair damaged solder masks, rebuild missing pad insulation, and restore motherboard surfaces after chip removal or under-IC wire repairs. Each stencil is manufactured according to original factory pad layouts for precise alignment and accurate repair results.
Specifications
Specification | Details |
Brand | QIANLI |
Product Type | UV Solder Mask Repair Stencil Set |
Series | Qualcomm |
Quantity | 17 Pieces |
Material | High-Precision Stainless Steel |
Application | Solder Mask Repair & Pad Restoration |
Compatible Chips | Qualcomm CPU Series |
Alignment Accuracy | Factory Drawing Verified |
Reusable | Yes |
UV Curing Support | Yes |
Surface Finish | Burr-Free Precision Openings |
Features
- Designed specifically for Qualcomm CPU motherboard repair.
- High-precision stencil openings for accurate pad restoration.
- Manufactured from original factory layout data.
- Burr-free mesh holes help prevent uneven UV mask application.
- Suitable for repairing damaged solder mask and PCB insulation layers.
- Reusable professional repair tool for mobile phone technicians.
Supported Qualcomm Chipsets
- SM8450
- SM8350
- SM8150
- SM8250
- SM7250
- SM7350
- SM7225
- SM7125
- SM7450
- SM8550
- SM8475
- SDM845
- SM7150
- SM6450 / SM7435
and other Qualcomm series chipsets included in the stencil pack.
What's in the Box
- 17 × Qualcomm UV Repair Stencils
- 1 × Protective Storage Pack
Package Information
Item | Value |
Weight (WT) | Approx. 30 g |
Length (L) | Approx. 15 cm |
Width (W) | Approx. 10 cm |
Height (H) | Approx. 1 cm |
Qianli کوالکوم سیریز (17 عدد) uv اسٹینسل سیٹ
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