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The MEGA-IDEA MTK CPU1 Stencil is a professional BGA reballing stencil designed for repairing MediaTek (MTK) CPU chips on mobile phone motherboards. Manufactured from high-grade 0.12mm stainless steel, it provides precise solder paste placement and accurate pad alignment for clean, reliable IC reballing. Its heat-resistant and reusable construction makes it an ideal tool for professional mobile repair technicians.
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea |
| Model | MTK CPU1 |
| Type | BGA Reballing Stencil (CPU IC Repair Tool) |
| Material | High-Grade Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | Mobile Phone Motherboard and IC Repair |
| Compatibility | Selected MediaTek (MTK) CPU Chipsets |
| Country of Origin | Mainland China |
| Reusable | Yes |
| Packaging | Metal Sheet / Protective Case (Varies by Batch) |
This stencil is designed for specific MediaTek (MTK) CPU layouts. Always verify compatibility with your CPU model before reballing to ensure proper solder ball alignment and reliable repair results.
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The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea / Qianli |
| Model | QS729 (Bumblebee Series) |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | iPhone Motherboard IC / Chip Reballing Repair |
| Compatibility | iPhone 17 / 17 Pro / 17 Pro Max / Air |
| Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Pack (Depends on Batch) |
This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.
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The RELIFE RL-044 BGA Stencils Set is a professional-grade reballing template set designed for mobile phone, laptop, and electronic IC repair. The set includes multiple stencil thickness options (0.12mm, 0.3mm, 0.35mm, 0.4mm, and 0.5mm) to meet the requirements of different BGA IC chips.
These precision stainless-steel stencils provide accurate solder ball alignment during the reballing process, ensuring clean, reliable, and efficient repairs. They are ideal for mobile motherboard repair, CPU and GPU IC rework, micro soldering, and professional electronics servicing.
| Brand | RELIFE |
| Model | RL-044 |
| Type | BGA Reballing Stencil Set |
| Thickness | 0.12mm / 0.3mm / 0.35mm / 0.4mm / 0.5mm |
| Material | Precision Stainless Steel |
| Application | Mobile Phone, Laptop, CPU, GPU, and IC Chip Reballing |
| Weight | Approx. 20–40 g (Depending on Set) |
| Length | Approx. 13–15 cm |
| Width | Approx. 7–10 cm |
| Thickness | 0.12mm – 0.5mm (Model Dependent) |




MC IP 7 PLUS 3400mAh BATTERY
Description
Replace your old battery that doesn't last as long anymore, charges slowly, or is completely dead with our OEM quality battery.
Quality Description
**PLEASE NOTE ABOUT THE TOOLS** - The tools are universal and are meant to assist in replacing MOST repair parts. However, you MAY need specific tools for your specific part that will NOT come with the universal tool kit. PLEASE CHECK BEFOREHAND THE TOOLS YOU NEED AND MESSAGE US TO SEE IF OUR TOOLS ARE COMPATIBLE.
Tool kit does NOT come with a Tri Wing Screwdriver.
Compatibility





