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MEGA IDEA Stencil (QS729) برائے iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)
Mega iDea MTK CPU1 Stencil (Mega iDea MTK CPU1)
MEGA-IDEA MTK CPU1 BGA Reballing Stencil
The MEGA-IDEA MTK CPU1 Stencil is a professional BGA reballing stencil designed for repairing MediaTek (MTK) CPU chips on mobile phone motherboards. Manufactured from high-grade 0.12mm stainless steel, it provides precise solder paste placement and accurate pad alignment for clean, reliable IC reballing. Its heat-resistant and reusable construction makes it an ideal tool for professional mobile repair technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea |
| Model | MTK CPU1 |
| Type | BGA Reballing Stencil (CPU IC Repair Tool) |
| Material | High-Grade Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | Mobile Phone Motherboard and IC Repair |
| Compatibility | Selected MediaTek (MTK) CPU Chipsets |
| Country of Origin | Mainland China |
| Reusable | Yes |
| Packaging | Metal Sheet / Protective Case (Varies by Batch) |
Features
- High-precision CPU reballing stencil.
- Manufactured from durable stainless steel.
- Heat-resistant and long-lasting construction.
- Accurate pad alignment for MediaTek CPU chips.
- Ultra-thin 0.12mm design for precise solder paste application.
- Reusable for multiple repair applications.
- Suitable for professional mobile phone repair and IC rework.
What's in the Box
- 1 × MEGA-IDEA MTK CPU1 Stencil Sheet
Important Note
This stencil is designed for specific MediaTek (MTK) CPU layouts. Always verify compatibility with your CPU model before reballing to ensure proper solder ball alignment and reliable repair results.
میگا آئیڈیا mtk cpu1 اسٹینسل
MEGA IDEA Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA) (MEGA-IDEA QS729)
MEGA-IDEA Bumblebee Stencil (QS729) For iPhone 17 / 17 Pro / 17 Pro Max / Air
Product Description
The MEGA-IDEA Bumblebee Stencil QS729 is a professional-grade BGA reballing stencil designed for iPhone 17 series motherboard IC repair. It is used for applying solder balls accurately on IC chips during rework and refurbishment. The ultra-thin precision design ensures perfect alignment and clean soldering results, making it an ideal tool for professional mobile phone technicians.
Specifications
| Specification | Details |
|---|---|
| Brand Name | Mega-Idea / Qianli |
| Model | QS729 (Bumblebee Series) |
| Type | BGA Reballing Stencil (IC Repair Tool) |
| Material | High-quality Stainless Steel |
| Thickness | 0.12mm (Ultra Thin) |
| Application | iPhone Motherboard IC / Chip Reballing Repair |
| Compatibility | iPhone 17 / 17 Pro / 17 Pro Max / Air |
| Origin | Mainland China |
| Reusable | Yes |
| Package | Metal Sheet / Protective Pack (Depends on Batch) |
Features
- High-precision BGA reballing stencil
- Premium stainless steel construction
- Heat-resistant and durable design
- Accurate IC pad alignment for iPhone 17 series
- Ultra-thin 0.12mm precision stencil
- Reusable for multiple repair cycles
- Ideal for professional motherboard repair technicians
What's in the Box
- 1 × MEGA-IDEA Bumblebee QS729 Stencil Sheet
Important Note
This stencil is specifically designed for iPhone 17 / 17 Pro / 17 Pro Max / Air motherboard IC layouts. Please verify your device model before use to ensure accurate alignment and reliable reballing performance.
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MEGA IDEA Stencil (QS729) برائے iPhone 17 / 17 Pro / 17 Pro Max / Air (MEGA-IDEA)
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